Nichia Corporation

Takeshi Okada

Yukihiro Hayashi

Naoto Morizumi

Takashi Miyoshi

An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face, and an outer peripheral side surface, and at least one functional film selected from a group consisting of a short pass filter, a long pass filter, and a heat dissipation member and disposed on a surface of the second light-transmissive member.

Optical component and its method of manufacture, and light emitting device and its method of manufacture

A light emitting device wherein discoloration of a reflective layer in an optical component can be prevented and a stable optical output power can be maintained, and a method of manufacturing an optical component used in the light emitting device. The optical component includes a supporting member defining a through-hole, a reflective layer formed on an inner wall defining the through-hole, a protective layer formed on the reflective layer, and a light transmissive member having a light incident surface, a light emitting surface, and an outer circumference side-surface, and disposed in the through hole. The light transmissive member is fixed in the through-hole with a joining portion where the outer circumference side-surface and the protective layer are joined, and an end portion at the light emitting side of the joining portion is covered with a second protective layer disposed continuously on the protective layer and the light transmissive member.

Light emitting device and method of manufacturing light emitting device and optical component used in the same

Optical component and its method of manufacture, and light emitting device and its mehtod of manufacture

An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face and an outer peripheral side surface, and an outer peripheral side surface, a fused first light-transmissive member formed between an inner wall of the through-hole and the outer peripheral side surface of the second light-transmissive member.

The nitride semiconductor laser device includes a substrate, a nitride semiconductor layer having a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer stacked in this order on the substrate, and a ridge provided on a surface of the nitride semiconductor layer. The surface of the nitride semiconductor layer includes a generally flat part and first and second grooves which extend along the ridge in a resonator direction, the first groove being formed continuous to a first side surface of the ridge, the second groove being formed continuous to a second side surface of the ridge which is opposite to the first side surface.

Growing community of inventors

Tokushima, Japan

Takeshi Okada