Mitsubishi Materials Corporation

Nec Corporation

Ricoh Company, Ltd.

Takeshi Negishi

Takahiro Asai

Yoshinaga Kato

Kenji Tanaka

Toshiyuki Nagase

Yoshiyuki Nagatomo

Kazuaki Kubo

Katsuyuki Kaji

Shoichi Shimamura

Asao Tokiwa

A relay device is communicable with a communication management system that stores relay device identification information for identifying a relay device capable of communicating with a communication terminal using a first communications protocol, in association with configuration data that allows the communication terminal to communicate using a second communications protocol. In response to a configuration data request received from a communication terminal using the first communications protocol, the relay device transmits relay device identification information to the communication management system to obtain configuration data associated with the relay device identification information, and transmits the configuration data to the communication terminal.

Communication management system, relay device, communication control system, communication system, communication method, and recording medium storing communication control program

A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

A high-efficiency production method for a power module substrate with reduced line width of a conductive pattern provides an insulation substrate suitable for realizing a large current and a high voltage of a power module. According to the method, a brazing sheet is temporarily fixed on a first surface of a ceramics substrate by surface tension of a volatile organic liquid. The brazing sheet is also temporarily fixed on the first surface of a conductive pattern member punched from a base material by surface tension of same type of volatile organic liquid. The brazing sheet and the conductive pattern member are heated so as to volatilize the volatile organic liquid and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the first surface of the ceramics substrate.

A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent which includes boron provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5, as an amount of boron measured by fluorescence X-ray analysis, where the amount of boron is defined as a value obtained by an expression: (a peak height of B-K&#x3b1;/a peak height of X-K&#x3b1;) x 100000 and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

A heat sink is obtained that has high thermal conductivity as well as satisfactory moldability and corrosion resistance by using a malleable material made of aluminum or aluminum alloy. Liquid cooled heat sink has a passage in which coolant is able to pass, and is joined to a ceramic substrate. A plurality of through holes extending from one end to the other end are formed by a plurality of dividing walls through in flat casing of which both ends are open, and notches are formed on one or both ends of the plurality of dividing walls. Corrugated fins are respectively inserted into each of the plurality of through holes, and each through hole is demarcated into a plurality of slots extending from one end to the other end of the casing by these fins. Both ends of the casing are closed by a pair of covers and and coolant inlet and outlet are formed in the covers. The above passage is formed by communication of the notches and slots, and the above inlet and outlet are positioned on both ends of the passage.

Liquid-cooled heat sink and manufacturing method thereof

In a time division multiple access network comprising a standard station and at least one particular terrestrial station which has a preassigned station address and which is operated in accordance with a current burst time plan and/or channel assignment pattern table, a switching data signal is sent from the standard station to the particular terrestrial station with an indicated preassigned station address, indicated in addition to a switch execution signal. Responsive to the preassigned station address, the particular terrestrial station switches from the current table to a new one. For this purpose, the standard station comprises a station data generation circuit for producing a station address signal representative of the preassigned station address, while the particular terrestrial station comprises a station address decoder which detects the station address signal and switches the tables from the current one to the new one only when the preassigned station address is detected.

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Saitama, Japan

Takeshi Negishi