Mitsubishi Denki Kabushiki Kaisha

Takeshi Muraki

Seiji Oka

Satoshi Yanaura

Yasuo Kawashima

Hirofumi Fujioka

Hideki Tsuruse

Takayuki Yuyama

Shigeru Utsumi

Taichi Kase

A wiring board includes a first conductor formation substrate having a first substrate and a first electrode; a second conductor formation substrate having a second substrate and a second electrode; and a dielectric sandwiched between the first conductor formation substrate and the second conductor formation substrate. The dielectric includes a dielectric film that is not melted during thermo-compression bonding, and an adherent insulator melted during thermo-compression bonding. The surface of the dielectric film is subjected to a treatment to improve wettability. Adherence of the adherent insulator in thermo-compression bonding to the dielectric film is facilitated. The distance between the first electrode and the second electrode is made uniform by interposing the dielectric film between the first and second electrodes. A wiring board ensured as to lifetime and improved in reliability, and a simple method of fabricating such a wiring board are achieved.

Wiring board, fabrication method of wiring board, and semiconductor device

In a method of manufacturing multi-layer printed wiring board, an uncured resin sheet is laminated on both surfaces of a printed wiring board having one or more layers, an organic cover film having a release property is laminated on the surfaces of the uncured resin sheets on upper and lower sides of the printed wiring board, a position of the printed wiring board is irradiated with a laser beam from the surface of the organic cover film to form a non-through hole that reaches a metal land for electrically conducting the layers of the inner printed wiring board, the non-through hole is filled with a thermosetting electrically conducting paste which is then half-cured, and the organic cover film is peeled off.

Method of manufacturing multi-layer printed wiring board

A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.

To provide a slim and miniaturized semiconductor integrated circuit device which eliminates the needs for making through holes and conducting in through holes and uses a carrier substrate with a small thermal expansion coefficient difference from a semiconductor chip. A semiconductor integrated circuit device using a carrier substrate having a plurality of extraction conductive layers 3 formed as a single layer on an insulating base body 11 having a thermal expansion coefficient of 4.times.10.sup.-6 .degree. C..sup.-1 to 16.times.10.sup.-6 .degree. C..sup.-1 and comprising a plurality of ball-like external connection terminals 7 in a plurality of closed-end holes 15 arriving at external connection parts 4, each of the external connection terminals 7 having a diameter larger than the depth of each of the closed-end holes 15.

Growing community of inventors

Tokyo, Japan

Takeshi Muraki