Kyocera Corporation

Toshiba Materials Co., Ltd.

Okutec Co., Ltd.

Takeshi Muneishi

Yoshihiro Okawa

Yoshiyuki Fukuda

Akira Komoto

Yuusaku Ishimine

Yasunori Kawanabe

Kazuhiko Fujio

Yuichi Abe

Keiichi Sekiguchi

Katsuya Okumura

Takao Shirai

Kentaro Takanami

Toshihiko Uemura

Yoshihiro Komatsu

A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.

Ceramic structure and wafer system

A circuit base of the present disclosure includes a base made of ceramic, a joint layer located on the base, and a metal layer located on the joint layer. The metal layer contains copper. The joint layer contains aluminum, silicon, and oxygen.

Circuit base, and heat dissipation base or electronic device provided with same

A planar coil in the present disclosure includes a substrate that is composed of a ceramic(s) and includes a first surface, and a first metal layer that is positioned on the first surface and includes a void.

Planar coil and transformer, wireless electric power transmission device, and electromagnet that include it

A structural body (A toE) according to the present disclosure includes a base (D,E), a first electrode layer (), a second electrode layer (), a first via conductor (), a second via conductor (), and a connection conductor (). The base (D,E) is composed of a ceramic. The first electrode layer () and the second electrode layer () are located inside the base (D,E). The first via conductor () and the second via conductor () are located inside the base (D,E) and connect the first electrode layer () and the second electrode layer (). The connection conductor is located inside the base (D,E), and connects the first via conductor and the second via conductor.

Structural body and heating apparatus

A heat exchanger includes a plurality of first members, and a plurality of second members located between adjacent first members of the plurality of first members. The plurality of first members each include a plurality of openings and a first flow path connected to the plurality of openings. The plurality of second members each include a second flow path connected to the openings of the adjacent first members. The plurality of openings and the first flow path of the first member, and the second flow path of the second member define a flow path for a first fluid. A region between the adjacent first members defines a flow path for a second fluid. The heat exchanger further includes a third member extending toward the region on the first member.

Heat exchanger

In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).

Manufacturing method for a member for a semiconductor manufacturing device and member for a semiconductor manufacturing device

A heater system may include a ceramic heater and a drive device. The ceramic heater may include a ceramic substrate and a resistance heating element. The ceramic substrate may include an upper surface. The resistance heating element may extend in an internal portion or on a surface of the ceramic substrate along the upper surface of the ceramic substrate. The drive device may include a main driving part, which supplies the main power to the entirety of the resistance heating element, and an additional driving part, which supplies additional power to a divided region that is a portion of the resistance heating element, by superimposing it on the main power.

Heater system, ceramic heater, plasma treatment system, and adsorption system

A semiconductor device may include a cooling unit, the cooling unit including a circuit unit, a first flow path member comprised of an insulating material, and a second flow path member comprised of an insulating material. The circuit unit may include a heat sink layer, a wiring layer, and a semiconductor element that is disposed between the heat sink layer and the wiring layer. The circuit unit is disposed between the first flow path member and the second flow path member. The wiring layer may face the first flow path member or the second flow path member.

Semiconductor device

A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet port and the outlet port inside the flow path member. A plurality of needle-shaped crystals may be arranged on a surface of the flow path where the needle-shaped crystals intersect each other.

Flow path member and semiconductor module

Because a sample holderis composed of a plurality of convex partsprovided on a top face of a base substance, and the plurality of convex partsare spherical surfacesformed of a single crystal or amorphous material, frictional wear of the sample at contact parts between a sampleand the convex partsis reduced, thereby making it possible to inhibit particle generation. Further, because a joining layeris formed of a single crystal or amorphous material, there is no defect that particles scattered on the sample holderfill up it, which makes it possible to easily keep it in a clean state by cleaning, and it is possible to effectively reduce reattachment of particles to the sample

Sample holder, sample suction device using the same, and sample processing method

A movable-body-speed-detecting apparatus includes a movable body capable of moving linearly and/or circularly, a plate fixed to the movable body, the plate having a predetermined length in a direction in which the movable body moves, and light emission/reception means arranged such that light output from a light-emitting element enters a light-receiving element. The plate has a window section that passes between the light-emitting element and the light-receiving element in accordance with movement of the movable body and that blocks or allows passage of light to the light-receiving element. The apparatus further comprises speed calculation means for calculating the speed of the movable body by converting the amount of light received by the light-receiving element into a signal and measuring the signal.

Growing community of inventors

Kyoto, Japan

Takeshi Muneishi