Hitachi Automotive Systems, Ltd.

Kabushiki Kaisha Toshiba

Hitachi, Ltd.

Toshiba Materials Co., Ltd.

Toshiba Tec Kabushiki Kaisha

Hitachi Astemo Ltd.

Nuflare Technology, Inc.

Hitachi Car Engineering Co., Ltd.

Takeshi Morino

Shinobu Tashiro

Keiji Hanzawa

Noboru Tokuyasu

Akira Uenodan

Ryosuke Doi

Yuki Okamoto

Tsutomu Kono

Yoshinori Honguh

Masataka Shiratsuchi

Atsushi Inoue

Chihiro Kobayashi

Hiroshi Ohno

Naoki Saito

Masatoshi Hirono

Yuuki Okamoto

Takahiro Suzuki

Satoshi Arai

Hideki Ito

Shigeharu Tsunoda

Hiromichi Hayashihara

Shinya Igarashi

Hideaki Okano

Norio Ishitsuka

Masashi Fukaya

Tsubasa Watanabe

Masayuki Hio

Masatoshi Ogata

Takahiro Miki

Ryo Sato

Hiroshi Hirayama

Rieko Fukushima

Tsuyoshi Hioki

Katsumi Hisano

Yoshihiko Akagi

Ryoichi Hirano

Mitsuaki Kato

Seiji Ikari

Akio Yasukawa

Kenzo Isogawa

Hiromu Kikawa

Yasuo Onose

Yuichiro Yamamoto

Hideaki Hashimoto

Yoshiharu Momonoi

Kazuyasu Ohwaki

Yasuji Nishi

Tomoaki Saito

Hiroshi Fukuta

Takuto Okamoto

Taiji Shoyama

Kohei Suseki

Naoto Tokuhara

Masatomo Ide

Kiichi Otaka

Yasunobu Kojima

Masanobu Ino

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

Flow sensor, method for manufacturing flow sensor and flow sensor module

An inspection apparatus including an image generation device which generates a second image corresponding to a first image, and a defect detection device which detects a defect in the second image. Each of the first and second image includes partial regions each including pixels. The defect detection device is configured to estimate a first value indicating a position difference between the first and second image for each of the partial regions, based on a luminance difference between the first and second image, estimate a second value indicating a reliability of the first value for each of the partial regions, and estimate a position difference between the first and second image for each of the pixels, based on the first and second value estimated for each of the partial regions.

Inspection apparatus, inspection method and storage medium that detects defects in images

According to one embodiment, an inspection device includes: an image generation device configured to generate a second image corresponding to a first image; and a defect detection device configured to estimate a nonlinear shift based on a plurality of partial region sets, each of the partial region sets including a first partial region in the first image and a second partial region in the second image corresponding to the first partial region, and detect a defect in the second image from the first image.

Inspection device, inspection method, and storage medium

According to one embodiment, an illumination device includes a plurality of light emitting elements and a plurality of reflectors. The plurality of reflectors include at least one first reflector and at least one second reflector. The first reflector is provided corresponding to the first region at the center and is provided so that the corresponding light emitting element is positioned within a focal region in the vicinity of a focal point. The second reflector is provided corresponding to the second region, has an angular eccentricity so as to collect light on one region on the optical axis, and is provided so as to be positioned within a margin region in which one of the corresponding light emitting elements is provided at a position farther away than a second focal region in the vicinity of the focal point.

Illumination device

The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package () that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing () having an inlet trench (), a bypass passage trench on frontside (), an outlet trench (), and the like are formed through resin molding, and an outer circumferential surface of the circuit package () produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package () to the housing ().

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

The present invention addresses the problem of obtaining a thermal flow meter capable of reducing a pulsation error by preventing a discharge port and a main outlet from being blocked by a vortex during a transient period and reducing a difference between flow speed distributions in normal and pulsation states. This thermal flow meter is provided with a housing disposed in a main passage; and a sub passage provided in the housing. In addition, in the housing, a first outlet and a second outlet of the sub passage are disposed in a downstream end portion of the housing, and a curved surface section is provided adjacent to the first and second outlets.

Thermal flow meter with housing surfaces that minimize vortex formation

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.

Flow meter

In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting elementfor temperature detection, and a conductive metal lead framethat supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Thermal airflow measuring device

The present invention provides a thermal flowmeter having good measurement accuracy by reducing deviation in the flow velocity distribution of a gas under measurement flowing through an auxiliary passage. An auxiliary passagefor taking in a portion of a gas under measurement IA flowing through a main passagehas a curved passagethat bends toward a flowrate measurement element. The curved passagehas a resistance portionformed therein that applies resistance to the flow of the gas under measurement IA flowing through the outer peripheral side CO of the curved passageso that the pressure loss of the gas under measurement IA flowing through the outer peripheral side CO is high compared to that of the gas flowing through the inner peripheral side CI of the curved passage

Thermal flowmeter

A thermal flowmeter circuit package having a side of a measurement surfaceof the circuit package and a flow pathat a side of the backside of measurement surfaceof a rear surface of the measurement surface, and an inflow-side end surface of the circuit package for dividing the measurement target gashas different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gasis formed with a reference linedividing the measurement target gas, and an end surfaceat the side of the measurement surface with respect to the reference line and an end surfaceat the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.

Thermal flow meter with an asymmetrical inflow-side of circuit package

A thermal type air flow meter, capable of suppressing deformation of a base member at the time of molding to secure dimensional accuracy and reduce an influence of a dimension change on measuring accuracy, is to be placed in an intake passage of an internal combustion engine. The thermal type of air flow meter includes a resin component having a secondary passage into which part of the air passing through the intake passage can flow, and a circuit board configured to output a signal according to an air flow rate based on a signal from a flow rate detecting element disposed on the circuit board. The circuit board on which the flow rate detecting element is disposed is installed so that the flow rate detecting element is placed in the secondary passage. The resin component includes a board fixing part to which the circuit board is fixed, a secondary passage constituting part that is a part of the secondary passage, and ribs provided on a rear surface, which is a side opposite to a surface of the board fixing part, with the ribs forming a grid pattern.

Thermal type air flow meter having a reinforcing structure provided on the base member between the board fixing part and the secondary passage constituting part

A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Thermal flow meter

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector. The thermal flow meter includes a bypass passage through which a measurement target gas flowing through a main passage flows, and a circuit package which includes a measurement circuit for measuring a flow rate of the measurement target gas flowing through the bypass passage and a temperature detecting portion for detecting a temperature of the measurement target gas. The circuit package includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion molded by the resin. The temperature detecting portion is provided in the leading end portion of the protrusion, and at least the leading end portion of the protrusion protrudes to the outside from a housing.

Thermal flow meter with a case having an external terminal for outputting an electric signal

Growing community of inventors

Hitachinaka, Japan

Takeshi Morino