Dexerials Corporation

Takeshi Miyake

Reiji Tsukao

Shoko Kuga

Tatsurou Fukaya

In a filler-containing film in which fillers are dispersed in a resin layer, a flow of the fillers caused by an unnecessary flow of the resin layer is suppressed during the pressure bonding of the filler-containing film and an article. This filler-containing film (A) includes a filler-dispersed layer () in which fillers () are dispersed in a resin layer (). The surface in the vicinity of the fillers () of the resin layer () has concavities () and () with respect to the tangent plane to the central portion of the surface of the resin layer () between adjacent fillers (). The ratio (La/D) of a layer thickness La of the resin layer () to a particle diameter D of the filler () is preferably from 0.6 to 10.

Filler-containing film

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

Anisotropic conductive film

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

An anisotropic conductive film is thermo-polymerizable and includes an electrically insulating base layer, an adhesive layer, an intermediate layer sandwiched therebetween, and electrically conductive particles retained by any of the layers. The intermediate layer and the adhesive layer each have a melt viscosity higher than the melt viscosity of the electrically insulating base layer. The electrically conductive particles are independent of one another when the anisotropic conductive film is viewed in plan. The modulus of elasticity of the anisotropic conductive film as a whole, at 100&#xb0; C., after thermal polymerization, is higher than 1800 MPa.

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Oyama, Japan

Takeshi Miyake