Ushio Denki Kabushiki Kaisha

Takeshi Minobe

Shinji Suzuki

Yoshiki Mimura

Shinetsu Miura

Hideki Okamoto

Hirofumi Takiura

A cooling arrangement of a heating device of the light irradiation type in which, even when the wafer is heated to a high temperature of roughly 800 to 1200&deg; C., the respective parts, such as the arc tube portion of the lamp, the insertion tube, the sealing area and the like can be easily controlled to a suitable temperature is achieved in a heating device of the light irradiation type, in which several lamps are disposed in a light irradiation chamber, each lamp having an arc tube portion, at least one insertion tube and at least one sealing area arranged on an at least one end of the arc tube portion, by the provision of a mirror which reflects the light from the arc tube portions behind the arc tube portions of the lamps and which has opening through which the insertion portion and the sealing areas pass; a cover chamber which has a plate with opening through which the sealing area of the lamps pass, and a cover with an opening for cooling air; and a wind box which is located between the plate of the cover chamber and the mirror and which is connected via a channel to an air mover, e.g., a blower, for drawing in or blowing in a cooling air flow. The air mover is connected to the opening for cooling air in the cover via the opening of the cover chamber plate, the wind box and the channel and being connected to the opening for cooling air in the light irradiation chamber via the opening of the mirror, the wind box and the channel.

Cooling arrangement of a heating device of the light irradiation type

To effect exposure of the peripheral area of a wafer to remove an unnecessary resist with a step shape in a development process with high precision and ease, even if the position has errors, in which a circuit pattern is formed on a semiconductor wafer in a preceding process, according to the invention, before exposing the unnecessary resist on a wafer outside of the area on which a pattern is formed, the position of a singular shaped area, such as an 'orientation flat' or the like is determined by a unit for determining the peripheral edge area of the wafer, and the rotating carrier is driven and the wafer is rotated until the singular shaped area is positioned in a predetermined position. Furthermore, according to the invention, a unit for determining the alignment marks computes and stores the positions of predetermined alignment marks, by which positional errors in the location in which the circuit pattern is formed are corrected. Then, the rotating carrier is driven again, and fine adjustment of the position of the exposure area on the wafer is performed.

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Yokohama, Japan

Takeshi Minobe