Fujitsu Corporation

Takeshi Midorikawa

Kenichiro Abe

Akiyoshi Saitou

Chikayuki Kumagai

Masashi Fujimoto

Toru Kuraishi

A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

Growing community of inventors

Kawasaki, Japan

Takeshi Midorikawa