Matsushita Electric Industrial Co., Ltd.

Other

Kabushiki Kaisha Nihon Genma

Takeshi Meguro

Motomi Sakoda

Kenji Hirai

Masaji Sakamoto

Masaki Watanabe

Kaoru Shimizu

Takashi Nagashima

Toshiaki Ogura

Yasuji Kawashima

Jon Wigham

Kazutoshi Iida

Kazuhiko Senoo

Tsutomu Koino

Hitoshi Asayama

Naoki Kohyama

Hideo Chaki

Akihiko Matsuike

A lamp includes a glass bulbwith a concave portion, a baseattached so as to cover at least part of the concave portion, a leadfor supplying electrical power with an end section located in the concave portion, and lead-free solder. The lead free solderis composed mainly of Sn, and further contains, at least, between 5% and 40% inclusive of Sb and between 0% and 10% inclusive of Cu by mass, and has a solidus temperature of at least 235&#xb0; C.

Lamp

In a method for manufacturing a discharge tube including a discharge part, a sealing part formed at an end of the discharge part, and an electrode provided in the discharge part, the method includes inserting an electrode body having the electrode into a portion to be the sealing part that is adjacent to a portion to be the discharge part of a transparent insulating tube serving as a material for the discharge tube, and then sealing the portion to be the sealing part by heating and softening with a combination of a laser beam and a gas burner, thus forming the sealing part. Heat sources are selected suitably according to each region in the portion to be the sealing part, whereby a high-quality discharge tube that is highly resistant to pressure can be manufactured at high production efficiency and low cost.

Method for manufacturing discharge tube and discharge lamp

A method for manufacturing a discharge tube, including heating a quartz tube by irradiation and closing it shut, is presented, in which variation of the heating temperature of the quartz tube can be reduced. Laser light is irradiated on a portion of the quartz tube, and in the step of sealing the portion of the quartz tube onto which laser light has been irradiated, the laser light is scanned while oscillating back and forth. The intensity of the laser light is controlled such that the intensity of the laser light when the size of a displacement of the laser light is maximal is smaller than the intensity of the laser light when the size of the displacement of the laser light is minimal.

Method for manufacturing a discharge tube

The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be fixed to a circuit board. This invention also provides a mounting process for semiconductor devices.

Mounting structure and mounting process from semiconductor devices

A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Solder

Growing community of inventors

Ibaraki, Japan

Takeshi Meguro