Nichia Corporation

Citizen Electronics Co., Ltd.

Citizen Holdings Company, Ltd.

Takeshi Kususe

Kenji Ozeki

Takahiko Sakamoto

Daisuke Sanga

Hisashi Kasai

Takao Yamada

Satoshi Shichijo

Kunihito Sugimoto

Takanobu Sogai

Takayuki Sogo

Toshiaki Ogawa

Shunsuke Minato

Yoshiyuki Aihara

Nodoka Oyamada

Dai Wakamatsu

Daisuke Kishikawa

Taiki Yuasa

Naoki Azuma

Takashi Ichihara

Kouichiroh Deguchi

Takaaki Tada

Shusaku Bando

Takuya Yamanoi

Kazuya Tamura

Koji Honjo

Koichiro Deguchi

A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

Light-emitting device

A method of manufacturing a light-emitting device includes: directly bonding a plurality of light-emitting elements to a collective light-transmissive member having a plate shape, each light-emitting element comprising a plurality of electrodes; subsequently, forming stud bumps on each electrode of each light-emitting element; subsequently, dividing the collective light-transmissive member to obtain a plurality of light-transmissive members on each of which one or more of the light-emitting elements are bonded; and subsequently, mounting the light-emitting elements on or above a mounting base by a flip-chip technique.

Method of manufacturing light-emitting device

A light emitting device includes a light emitting element, a light transmissive member, and a cover member. The light transmissive member is disposed on an upper face of the light emitting element. The cover member covers a lateral face of the light emitting element and a lateral face of the light transmissive member, and includes first and second cover members. The first cover member is disposed adjacent to the lateral face of the light emitting element and the lateral face of the light transmissive member, and contains a first light reflecting material and a fluorine-based first resin. The second cover member covers the first cover member, and contains a second light reflecting material and a second resin. A refractive index difference between the first light reflecting material and the first resin is larger than a refractive index difference between the second light reflecting material and the second resin.

Light emitting device and method of manufacturing same

A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak emission wavelength in a wavelength range of 380 nm or longer and 430 nm or shorter. A light transform layer is disposed on the light emitting surface of the light emitting element to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A reflecting film is provided on the light transform layer to reflect the first light and to transmit the second light. The reflecting film has a reflectivity of 40% or more in a reflection spectrum of the reflecting film with respect to a light having a wavelength of 380 nm or longer and 430 nm or shorter and an angle of incidence from 0&#xb0; to 85&#xb0;.

Light emitting device

A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess.

Light emitting device and method of manufacturing light emitting device

A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.

Light emitting device including light emitting element, outer connection electrodes and resin layer

A nitride semiconductor device includes a conductive oxide film with high reliability is provided. The nitride semiconductor device having a nitride semiconductor layer includes a conductive oxide film on the nitride semiconductor layer and a pad electrode on the conductive oxide film. The pad electrode includes a junction layer that contains a first metal and is in contact with the conductive oxide film, and a pad layer that contains a second metal.

Nitride semiconductor device

A semiconductor light emitting device includes a semiconductor structure, a transparent electrically-conducting layer, a dielectric film, and a metal reflecting layer. The semiconductor structure includes an active region. The transparent electrically-conducting layer is formed on the upper surface of the semiconductor structure. The dielectric film is formed on the upper surface of the transparent electrically-conducting layer. The metal reflecting layer is formed on the upper surface of the dielectric film. The dielectric film has at least one opening whereby partially exposing the transparent electrically-conducting layer. The transparent electrically-conducting layer is electrically connected to the metal reflecting layer through the opening. A barrier layer is partially formed and covers the opening so that the barrier layer is interposed between the transparent electrically-conducting layer and the metal reflecting layer.

Semiconductor light emitting device including metal reflecting layer

A nitride semiconductor light-emitting device includes a layered portion emitting light on a substrate. The layered portion includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The periphery of the layered portion is inclined, and the surface of the n-type semiconductor layer is exposed at the periphery. An n electrode is disposed on the exposed surface of the n-type semiconductor layer. This device structure can enhance the emission efficiency and the light extraction efficiency.

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

A semiconductor light emitting device with improved efficiency in extracting light is provided. The semiconductor light emitting device comprises a first conductive type semiconductor layer, a light emitting layer, and a second conductive semiconductor layer stacked in this order, electrodes respectively connected to the first and second conductive semiconductor layers, the electrode connected to the second conductive type semiconductor layer comprising a lower conductive oxide film and an upper conductive oxide film disposed on the lower conductive oxide film, and a metal film disposed only on the upper conductive oxide film. The upper and lower conductive oxide films comprise an oxide including at least one element selected from the group consisting of zinc (Zn), indium (In), tin (Sn), and magnesium (Mg).

Semiconductor light emitting device having an electrode made of a conductive oxide

A light-emitting diode capable of making its light emission more uniform without too high a concentration current and of improving the efficiency of outgoing light and its life. In the light-emitting diode, the n-side electrode has an n-side connecting portion and an n-side extending portion, which extends in the longitudinal direction from a predetermined part of the n-side connecting portion, and the p-side pad member has at least a p-side connecting portion to be connected to a conductive member. The light-emitting diode further includes an n-side connecting area, in which the n-side connecting portion is provided, provided in proximity to one end in the longitudinal direction, a p-side connecting area, in which the p-side connecting portion is provided, provided in proximity to another end in the longitudinal direction, and a middle area provided between them, and the n-side extending portion is positioned in the middle area, and extends so as to be opposed to the p-side current diffusing member.

Growing community of inventors

Tokushima, Japan

Takeshi Kususe