Hitachi, Ltd.

Takeshi Kuroda

Takayuki Ono

Kenichi Kasai

Mitugu Shirai

Tsutomu Imai

Kiyoshi Matsui

Morio Suzuki

Hideyuki Fukasawa

Toshitaka Murakawa

Takeji Siokawa

Naoki Watanabe

Takeshi Takahashi

Kaoru Katayama

A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion. The solder adhering to the second member is melted when heated by the heating portion through the first member and adheres to the first member. As a result, the solder is removed from the second member.

Solder removing apparatus

A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.

Electronic device and multi-pin connector therefor

A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Multi-pin connector

Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.

Method of making multi-pin connector

Growing community of inventors

Hadano, Japan

Takeshi Kuroda