Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Takeshi Kurihara

Noboru Kato

Kuniaki Yosui

Yuki Wakabayashi

Naoto Ikeda

Bunta Okamoto

Keiichi Ichikawa

Koji Shiroki

Makoto Osamura

Masami Mizuyama

An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

Electronic device

Inductor bridge and electronic device

The disclosure provides a non-contact power receiving apparatus including a conductive pattern in a second region of a substrate not covered by a magnetic sheet. The conductive pattern includes first and second electrodes provided in a first plane parallel to a surface of the substrate and arranged in a length direction of the conductive pattern. A third electrode is formed on a second plane parallel with the first plane. A first via hole connects superposed portions of the first and third electrodes to each other, and a second via hole connects superposed portions of the second and third electrodes to each other. As a result, loops of eddy currents generated in the conductive pattern can be made to be small, whereby eddy current loss can be reduced.

Non-contact power receiving apparatus

An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.

RFIC chip mounting structure

Growing community of inventors

Nagaokakyo, Japan

Takeshi Kurihara