Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electric Co., Ltd.

Takeshi Kuribayashi

Yasuhiro Maenishi

Tomoyuki Nakano

Hiroyoshi Nishida

Nobuyuki Nakamura

Kazuo Kido

Atsushi Tanaka

Satoshi Masuda

Yoshihiko Misawa

Hideki Uchida

Koji Odera

Kanji Hata

Takao Naito

Shigeki Imafuku

Hiroshi Uchiyama

Akihiko Wachi

Kazuhiko Narikiyo

Kazuyuki Nakano

Satoshi Nonaka

Hiroki Yamamoto

Noboru Nishikawa

Susumu Takaiti

Yoshiyuki Hattori

Nobuyasu Nagafuku

Akihito Yamasaki

Yoshinori Seki

Chikashi Konishi

Keizo Izumida

Shigeki Matsushita Electric Industrial Co Ltd Imafuku

An operating time reducing method in which a processing procedure of a component mounting order determination method can be changed depending on the type of an operation loss that affects a component mounting time for mounting components onto the board is an operating time reducing method for a component mounter, wherein the method includes: an operation loss identifying step of identifying an operation loss to be resolved in the component mounter; a processing procedure selecting step of selecting, based on the identified operation loss, a processing procedure for reducing an operating time of the component mounter; and a processing procedure executing step of executing the selected processing procedure.

Operating time reducing method, operating time reducing apparatus, program and component mounter

A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Component mounting apparatus employing temperature maintenance of positioning accuracy

A transfer rackloaded with a seriate number of component supply cassettesto be handled collectively is carried and retained on a truckso that it can be taken in and out of the truck. The transfer rackis passed between the truckand a component supply section. Thus, the withdrawal of the transfer rackfrom the component supply sectionto the truckand the delivery of the transfer rackto the component supply sectionare executed in a timely manner so as to change the component supply cassettesat the component supply section 8. The transfer rackdelivered to the component supply sectionis positioned by operating an automatic positioning means at the component supply sectionin a direction in which it is loaded and unloaded and in a direction perpendicular to the direction in which it is loaded and unloaded.

Method and apparatus for collectively changing components at component supply section

Image data of various kinds of components and component text data required for mounting of components, e.g., shapes, dimensions, packing forms, colors, and the like of the components, are stored in a storage medium in a manner to be read out as part of a component electronic catalog. The storage medium is used to make a search for components on a screen and automatically read out necessary component text data. The component electronic catalog can be used not only to search for components on a screen, similar to a conventional component electronic catalog, but to automatically read out component text data so as to automatically form mounting data for components to be mounted which are selected through the screen search.

Component electronic catalog

There are provided a method and apparatus of component mounting capable of avoiding damage caused by production operations with a component holder having debris thereon. If it is determined during a detecting step of a component holding condition that a component is held by a component holder in an improper condition for mounting, the component holder releases such a component into a collecting box, and skips a pick up operation at a next round of a pick up station. The component holder is then subjected to confirming whether any debris exists by using, preferably, a condition sensor, and the component holder picks up a new component if it is confirmed that no debris exists. If debris is found during the confirming step, production operations are stopped, or a warning is generated. After maintenance of the component holder is completed, production operations are restarted.

Method for component mounting

A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device

An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method and apparatus for feeding components, and method and apparatus for mounting components

A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.

Component-mounting method and component-mounting apparatus

A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.

Electronic component mounting method

A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Component mounting method employing temperature maintenance of positioning apparatus

This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Method for mounting an electronic component

An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method for feeding a component

A component-lack advance notice method, a component-lack advance notice apparatus, and a component mounting apparatus including the component-lack advance notice apparatus, wherein a producible count determination part and advance notice parts are provided, so that an advance notice time from an advance notice of a lack of components to an actual occurrence of a lack of components is set beforehand. The producible count determination part obtains each advance notice remaining count of components to be supplied within the advance notice time from each component feed part on the basis of the advance notice time, and notifies a lack of components in advance on the basis of the advance notice remaining count.

Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium

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Yamanashi, Japan

Takeshi Kuribayashi