Kobe Steel, Ltd.

Takeshi Kudo

Yasuhiro Aruga

Katsura Kajihara

Akira Fugono

Katsushi Matsumoto

Hideto Oyama

Shogo Murakami

Yoshio Itsumi

Akihisa Fujita

The present invention provides a Cu&#x2014;Fe&#x2014;P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet

Disclosed is a pure titanium sheet having a strength corresponding to JIS Grade 2 level (215 MPa in terms of 0.2% yield strength) or more and having satisfactory stamping formability. The pure titanium sheet includes titanium and inevitable impurities, has a 0.2% yield strength of 215 MPa or more, has an average grain size d of its structure of 25 &#x3bc;m or more and 75 &#x3bc;m or less, and has a hexagonal crystal structure, in which respective grains in the hexagonal crystal structure have an average of Schmidt factors (SF) of (11-22) twins with a rolling direction as axes, and the average Schmidt factor (SF) and the average grain size d satisfy following Expression (1):0.055&#x2266;[SF/&#x221a;]&#x2266;0.084&#x2003;&#x2003;(1).

Pure titanium sheet excellent in balance between stamping formability and strength

The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

Copper alloy having high strength, high electric conductivity and excellent bending workability

A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al&#x2014;Mg&#x2014;Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.

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Kobe, Japan

Takeshi Kudo