Lintec Corporation

Takeshi Kondoh

Kazuhiro Takahashi

Kiichiro Kato

Katsuhisa Taguchi

Kazuyoshi Ebe

Hayato Noguchi

Kouichi Nagamoto

Pressure sensitive adhesive sheet and use thereof

Pressure sensitive adhesive composition and use thereof

A layer of base material has a film layer and a barrier layer on the film layer, and also adhesive tape has the base material and an adhesive layer on the barrier layer. Thus, they do not have any fish-eye or foreign substance on their surfaces, so that accuracy in thickness are improved and contamination of a material to be adhered with the adhesive layer is also improved.

Base material and adhesive tape using the same

An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided, which enables easy removal of any residual pressure sensitive adhesive by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.

Energy beam curable hydrophilic pressure sensitive adhesive composition

An energy beam curable pressure sensitive adhesive composition is disclosed which comprises at least two energy beam curable copolymers having energy beam polymerizable groups in side chains thereof. This energy beam curable pressure sensitive adhesive composition has satisfactory adhesive strength before the irradiation with energy beam and can be cured by the irradiation with energy beam to a degree such that the amount of adhesive residue remaining on an adherend after peeling is extremely small. Further, the above composition ensures excellent expansibility at the expanding step and excellent recognition at the time of pickup. Still further, the above composition exhibits high work efficiency because of very low pickup strength at the bonding step, irrespective of the execution of the expanding step.

Energy beam curable pressure sensitive adhesive composition and use

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Urawa, Japan

Takeshi Kondoh