Fujitsu Corporation

Takeshi Komiyama

Hiroshi Kobayashi

Shunji Baba

Hidehiko Kira

Norio Kainuma

Kenji Kobae

Toru Okada

Takatoyo Yamakami

Yasunori Sasaki

Tsuyoshi Yamamoto

Noritsugu Ozaki

Toshiyuki Nakada

Yoshihito Okuwaki

Harumi Yagi

A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Head assembly, disk unit, and bonding method and apparatus

Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation

A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

Method of forming solder bumps and method of forming preformed solder

On a printed circuit board, according to the present invention, IC packages are arranged in a matrix layout. The IC packages are soldered to the printed circuit board via their lead wires provided on the package sides along row and column lines of the matrix chip components are soldered to the printed circuit board, under each of the IC packages along lines angularly deviated from the row lines or the column lines of the matrix. Thus, the soldered portion of a chip component behind its adjacent chip component can be visually inspected along a view line parallel to the row line or the column line on a highly integrated printed circuit board.

Printed circuit assembly

Growing community of inventors

Kawasaki, Japan

Takeshi Komiyama