Matsushita Electric Works, Ltd.

Takeshi Koizumi

Yoshihiko Nakamura

Ryuji Takahashi

Hidetsugu Motobe

An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400&#xb0; C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

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Asaka-machi, Japan

Takeshi Koizumi