Murata Manufacturing Co., Ltd.

Takeshi Kogure

Atsushi Ono

Hiroyuki Nagamori

Syunji Yoshimi

Tomohide Aramata

Toshiki Matsui

Naohide Tomita

Satoshi Tanaka

Takanori Uejima

Hiromichi Kitajima

Yoichi Sawada

Kenichi Shimamoto

Yuji Takematsu

Hiroshi Masuda

Yusuke Tanaka

Kenji Tahara

Kunihiro Watanabe

Yoshiaki Sukemori

Yoshiki Kogushi

Yuuki Fukuda

Katsunari Nakazawa

Koji Yamashita

Shohei Imai

Seikoh Ono

Takeshi Abiru

A tracker module includes an integrated circuit, a first capacitor and a second capacitor arranged in or on a module laminate. The integrated circuit includes at least one switch in a switched-capacitor circuit and at least one switch in a supply modulator. The switched-capacitor circuit is configured to generate a plurality of discrete voltages. The supply modulator is configured to generate an output voltage by selectively switching among the plurality of discrete voltages based on a control signal. The first capacitor is a flying capacitor of the switched-capacitor circuit. The second capacitor is a smoothing capacitor of the switched-capacitor circuit. In a plan view of the module laminate, the first capacitor is arranged closer to the integrated circuit than the capacitor.

Tracker module

A radio frequency module is provided that includes a plurality of power amplifiers, an external connection terminal, a filter, and a switch. The amplifiers include a first power amplifier and a second power amplifier. The external connection terminal is connected to a tracker component configured to supply a power supply voltage to the power amplifiers. Moreover, the filter is not disposed on a first path between the external connection terminal and the first power amplifier, but instead it is disposed on a second path between the external connection terminal and the second power amplifier. The switch is configured to switch connection to the external connection terminal between the first path and the second path.

Radio frequency module, communication device, radio frequency circuit, and tracker module

A power amplifier circuit is provided that includes a transmission circuit, a control circuit, a first terminal, and a second terminal. The transmission circuit includes an amplifier element that amplifies power of a radio frequency signal. The control circuit controls the transmission circuit. The first terminal receives a serial data signal that is based on a serial data standard. The second terminal receives a digital signal different from the serial data signal. The control circuit then controls the transmission circuit in response to the digital signal received from the second terminal.

Power amplifier circuit, radio frequency circuit, communication device, radio frequency module, and amplification method

A tracker module is provided that includes a second substrate that is separate from a first substrate, a tracker component, and a low pass filter. A power amplifier is disposed on or in the first substrate. Moreover, the tracker component supplies a power supply voltage to the power amplifier. The low pass filter is disposed on a path between an output terminal of the tracker component and the power amplifier. The tracker component and the low pass filter are disposed on or in the second substrate.

Tracker module, power amplifier module, radio frequency module, and communication device

A radio-frequency module includes a mounting substrate, a transmission circuit element, and a reception circuit element. The mounting substrate has a first main surface and a second main surface. The transmission circuit element is provided on a signal path for a transmission signal of a first communication band. The reception circuit element is provided on a signal path for a reception signal of a second communication band. The second communication band is higher than the first communication band. The transmission circuit element is disposed on a same side of the mounting substrate as the first main surface of the mounting substrate. The reception circuit element is disposed on a same side of the mounting substrate as the second main surface of the mounting substrate.

Radio-frequency module and communication device

A power amplifier module includes a first amplifier, a power splitter, a second amplifier, a third amplifier, a phase shifter, a combining unit, and a controller. The first amplifier amplifies a first signal and outputs a second signal. The power splitter splits the second signal into a third signal and a fourth signal. The second amplifier amplifies the third signal and outputs a fifth signal. The third amplifier amplifies the fourth signal and outputs a sixth signal. The phase shifter receives the fifth signal and shifts a phase of the fifth signal. The combining unit combines the fifth signal having the phase shifted by the phase shifter and the sixth signal and outputs an amplified signal of the second signal. The controller outputs a first control signal for controlling a power level of the sixth signal output from the third amplifier.

Power amplifier module

A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.

Radio-frequency signal transmitting and receiving circuit

A high frequency module includes a duplexer that includes a transmission filter, a receive-only filter, and a power amplifier that power-amplifies a transmission signal. In order to improve the isolation characteristics between a transmission signal and a reception signal at the duplexer, the receive-only filter is arranged between the power amplifier and the duplexer.

High frequency module

To enhance the isolation between signal lines for transmitting high-frequency signals included in a circuit board. A circuit board includes a plurality of signal lines for transmitting high-frequency signals, a ground electrode positioned between the plurality of signal lines and spaced apart from each of the plurality of signal lines, and a plurality of via conductors connected to the ground electrode. When the circuit board is seen in plan view, the ground electrode has a protruded and recessed area in at least a section of an outer edge thereof, the protruded and recessed area outwardly protruded and inwardly recessed. The plurality of via conductors is positioned in the protruded and recessed area so as to match with a protruded and recessed shape of the protruded and recessed area.

Circuit board

Provided is a transmission/reception module that includes: a power amplifier that outputs a transmission signal to an input/output terminal; a low-noise amplifier that amplifies a reception signal input from the input/output terminal; a duplexer that isolates the transmission signal, which is output to the input/output terminal from the power amplifier via a transmission node and a common node, and the reception signal, which is input to the low-noise amplifier from the input/output terminal via the common node and a reception node, from each other; and a phase-shift circuit that is provided between an input node of the low-noise amplifier and the reception node of the duplexer, and that adjusts an impedance at the input node of the low-noise amplifier with respect to the transmission signal and the reception signal such that the gain of the transmission signal is smaller than the gain of the reception signal.

Transmission/reception module

On a substrate (), a resistor (R) is disposed between a position of an amplifier circuit () and a position of a duplexer (), thereby reducing coupling occurring in a space between the amplifier circuit () and a path extending from a main switch () to a reception terminal (P) through the duplexer (). Even when an RX terminal () of the duplexer () is oriented toward an amplifier circuit () side, a high-frequency module () reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P) through a path formed by the coupling. That is, the high-frequency module () can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.

High-frequency module

A front-end module includes a duplexer, a band pass filter, and a terminating circuit element. A first signal path connects an output terminal of a power amplifier and a transmit node of the duplexer. The band pass filter is disposed on a second signal path between a branch point and a ground. The second signal path branches off from the first signal path at the branch point. The band pass filter has frequency characteristics in which, among frequency components of a transmit signal output from the power amplifier, frequency components that overlap at least part of the pass band of a receive filter of the duplexer are allowed to pass through the band pass filter. The terminating circuit element is disposed on the second signal path between the band pass filter and the ground. The terminating circuit element attenuates a transmit signal passing through the band pass filter.

Front-end module

A multilayer substrate includes a component mounting electrode, an external mounting electrode, and a heat dissipating unit. The component mounting electrode is connected to an electronic component that is connected to an external structure. The heat dissipating unit is constituted by a plurality of via-conductors partially superposed each other in a stacking direction of the multilayer substrate and disposed continuously between the component mounting electrode and the external mounting electrode. The heat dissipating unit includes communicating portions, each in which one via-conductor is disposed per ceramic layer, and a branching portion in which a plurality of via-conductors are disposed continuously between the communicating portions per ceramic layer. Where the via-conductors of the branching portion and the via-conductor of the communicating portion are adjacent to each other, the positions of the centers of the adjacent via-conductors are separated from each other as viewed from the stacking direction.

Multilayer substrate

A communication module includes a power amplifier that amplifies a transmission signal having a first communication system or a second communication system and outputs an amplified signal to a signal path, a switch circuit that switches between a signal path for the first communication system and a signal path for the second communication system and outputs the amplified signal to one of the signal paths for the first communication system and the second communication system in accordance with a control signal supplied in accordance with the communication system of the transmission signal, and an impedance-matching network disposed between the power amplifier and the switch circuit, the impedance-matching network including a first variable capacitance element. The first variable capacitance element has a capacitance value that is controlled in accordance with the communication system of the transmission signal.

Growing community of inventors

Kyoto, Japan

Takeshi Kogure