Rohm Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Takeshi Kitamura

Hiroharu Inoue

Yasukazu Kondo

Junichi Itai

Koji Kishino

Keiko Kashihara

Takayuki Ishihara

Takashi Hoshi

A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: 

Prepreg, metal-clad laminated plate and printed wiring board

A metal-clad laminate of the present invention includes an insulating layer and a metal layer disposed on at least one surface of the insulating layer. The insulating layer is formed by laminating at least a center layer and surface resin layers disposed on both surfaces of the center layer. The center layer contains a heat-curable resin and includes a core layer containing at least one fibrous base material and a heat-curable resin layer that does not contain a fibrous base material. The ratio of the thickness of the surface resin layer to the thickness of the heat-curable resin layer is between 0.5 and 10.

Metal-clad laminate and printed wiring board

A pinprovided at a hornfor ultrasonic welding is press-fitted to the depth reaching the light guide platebreaking through the various kind of sheetsandfrom surface side thereof. Another embodiment of the invention is that pinsconstructed so as to break through various kind of sheetsandon the surface of the plate are provided on the light guide plate, and the various kind of sheetsandare fixed on the light guide plateby distorting by caulking using ultrasonic vibration of the tip end of the pin.

Back light unit for liquid crystal display device and method for manufacturing the unit

A pinprovided at a hornfor ultrasonic welding is press-fitted to the depth reaching the light guide platebreaking through the various kind of sheetsandfrom surface side thereof. Another embodiment of the invention is that pinsconstructed so as to break through various kind of sheetsandon the surface of the plate are provided on the light guide plateand the various kind of sheetsandare fixed on the light guide plateby distorting by caulking using ultrasonic vibration of the tip end of the pin.

A light emitting device includes a first patterned electrodeand a second patterned electrodeboth of which are formed on a wiring boardan LED chipmounted on the second patterned electrodea metal wireelectrically connecting the LED chipand the first patterned electrodeto each other, and a lens membermade of a transparent synthetic resin for packaging the LED chipand the metal wireThe first patterned electrodeis circular and formed with a cutoutat the center thereof. The second patterned electrodeis arranged in the cutoutWith this arrangement, the lens membercan be formed into a predetermined configuration, while the reflection of light by the patterned electrodes can be ensured.

Growing community of inventors

Kyoto, Japan

Takeshi Kitamura