Mitsubishi Materials Corporation

Kddi Corporation

Toyota Jidosha Kabushiki Kaisha

Denso Corporation

Takeshi Kitahara

Yoshiyuki Nagatomo

Yoshirou Kuromitsu

Hiroshi Tonomura

Tomoya Oohiraki

Ryohei Yumoto

Kazuhiro Akiyama

Hajime Nakamura

Hiroya Ishizuka

Koutarou Ichikawa

Toshiyuki Nagase

Nobutaka Matsumoto

Tomoyuki Watanabe

Daisaku Honda

Satoshi Konishi

Masayuki Itoh

Sotaro Oi

Yusuke Nakano

Osamu Kobayashi

Hidenori Akita

Yasuhiko Hiehata

Yoji Kishi

Ryo Tamura

Hiromasa Hayashi

Hiroshi Miyata

Satoshi Komorita

Masaki Fukushima

Kengo Kurosawa

Ryouhei Yumoto

Tomonobu Niwa

Akinari Nanba

Ryuu Mizoguchi

Takuya Miyasaka

Keisuke Kunitomo

Norihiro Fukumoto

Ryo Muranaka

When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.

Method for manufacturing bonded body and method for manufacturing insulation circuit substrate

Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board

An MEC node acquires, from each base station, a measured traffic volume in a cell (target cell) formed by each base station, and predicts a traffic volume after a unit time in the target cell based on the measured traffic volume. Upon receiving from a vehicle in the target cell an inquiry regarding whether or not data transmission is permitted, the MEC node determines whether or not to permit data transmission by the vehicle, based on a prediction result of the traffic volume, and a volume of data to be transmitted by the vehicle which is indicated by information included in the inquiry. In accordance with a result of the determination, the MEC node transmits, to the vehicle that has transmitted the inquiry, a response indicating whether or not to permit data transmission.

Node apparatus, method for controlling the same, and storage medium

A method is provided for producing an insulating circuit substrate with a heat sink including an insulating circuit substrate and a heat sink, the insulating circuit substrate including a circuit layer and a metal layer that are formed on an insulating layer, and the heat sink being bonded to the metal layer side. The method includes: an aluminum bonding layer forming step of forming an aluminum bonding layer formed of aluminum or an aluminum alloy having a solidus temperature of 650&#xb0; C. or lower on the metal layer; and a heat sink bonding step of laminating a copper bonding material formed of copper or a copper alloy between the aluminum bonding layer and the heat sink and bonding the aluminum bonding layer, the copper bonding material, and the heat sink to each other by solid phase diffusion bonding.

Method for producing insulating circuit substrate with heat sink

To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced. In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.

Method of manufacturing power module substrate board and ceramic-copper bonded body

A wireless communication apparatus mounted on a mobile body includes a transmitter and a receiver. The transmitter is configured to transmit position information indicating a position to which the mobile body is scheduled to move, to a server apparatus. The receiver is configured to receive communication quality information indicating a communication quality corresponding to the position, from the server apparatus. The transmitter is configured to transmit the date at a communication position specified based on the communication quality information.

Wireless communication apparatus and server apparatus

What is provided is a method of manufacturing an insulating circuit board with a heatsink including an insulating circuit board and a heatsink, the heatsink being bonded to the metal layer side of the insulating circuit board, the metal layer being formed of aluminum, and a bonding surface of the heatsink with the insulating circuit board being formed of an aluminum alloy having a solidus temperature of 650&#xb0; C. or lower. This method includes a high alloy element concentration portion forming step (S) of forming a high alloy element concentration portion and a heatsink bonding step (S) of bonding the heatsink, in which a ratio tb/ta of a thickness tb of the brazing material layer to a thickness to of the core material in the clad material is in a range of 0.1 to 0.3.

Method of manufacturing insulating circuit board with heatsink

A communication controller (communication control apparatus) acquires, from an MEC node (NW information collection unit), cell transition information for each vehicle that moves in a plurality of cells formed by a plurality of base stations connected to the MEC node. The communication controller determines a vehicle group that is made up of a plurality of vehicles and is to be subjected to uplink transmission control for path-dependent data based on the acquired cell transition information. The communication controller further performs, with respect to the determined vehicle group, transmission control for limiting uplink transmission of path-dependent data to a portion of vehicles that belong to the vehicle group.

Communication control apparatus, control method thereof, and storage medium

An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.

Insulation circuit board with heat sink

An MEC node, by analyzing signaling information transmitted between each of a plurality of eNBs and an MME, collects at least one of information indicating a mobility state and information indicating a communication state of a UE present within cells of the plurality of base stations. The MEC node decides a paging range based on the information collected as above upon receiving a paging message for paging the UE, the paging message having been transmitted by MME to one or more eNBs in accordance with a predetermined paging policy. The MEC node transmits a paging message for paging the UE to each eNB present in the decided paging range.

Node apparatus in a network, control method thereof, and storage medium for control of paging policy

Provided with an insulation circuit board in which a circuit layer is joined to one side of a ceramic substrate and a metal layer made of aluminum or aluminum alloy is joined to the other side of the ceramic substrate, and a heat sink joined to the metal layer; the heat sink has a first metal layer made of copper joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of copper or copper alloy joined to an opposite side of the ceramic board material to the first metal layer; and a thickness T1 of the first metal layer is 0.3 mm to 3.0 mm inclusive and equal to or more than a thickness T2 of the second metal layer.

A merging support information (MSI) distribution apparatus includes a MSI reception unit configured to receive MSI including a speed recommended for a vehicle traveling on a branch line to merge with a main line from a merging prediction apparatus, a distribution destination information reception unit configured to receive distribution destination registration information including terminal movement information indicating a movement state of a mobile terminal mounted on the vehicle traveling on the branch line and terminal identification information identifying the mobile terminal from the mobile terminal via a mobile communication network, and an information distribution unit configured to specify the mobile terminal to be a distribution destination to which the MSI is distributed based on the branch line traveling information and the terminal movement information, and distribute the MSI to the specified mobile terminal via the mobile communication network based on the terminal identification information of the specified mobile terminal.

Merging support information distribution apparatus, merging support system, merging support information distribution method, and computer program

An insulated circuit board having a ceramic substrate, a circuit layer on which a circuit pattern is formed and that is bonded to one surface of the ceramic substrate, and a metal layer bonded to the other surface of the ceramic substrate. The circuit layer has a first circuit layer that is bonded to the ceramic substrate and is made of aluminum and a second circuit layer that is bonded to the upper surface of the first circuit layer and is made of copper, the metal layer has a first metal layer that is bonded to the ceramic substrate and is made of aluminum and a second metal layer that is bonded to the upper surface of the first metal layer and is made of copper, and the thicknesses of the first circuit layer and the first metal layer are each 0.2 mm or more and 0.9 mm or less.

Insulated circuit board

Preventing a deformation when a metal layer made of copper or copper alloy is brazed on an aluminum-made cooler, a power-module substrate with cooler having low thermal resistance and high bonding reliability is provided: a circuit layer made of copper or copper alloy is bonded on one surface of a ceramic board and a metal layer made of copper or copper alloy is bonded on the other surface of the ceramic board; a second metal layer made of aluminum or aluminum alloy is bonded to the metal layer by solid-phase diffusion; and a cooler made of aluminum alloy is brazed on the second metal layer with Al-based Mg-included brazing material.

Growing community of inventors

Gotenba, Japan

Takeshi Kitahara