Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Takeshi Kita

Kazunobu Irie

Hidehiro Yoshida

Kazuki Fukada

Kenichi Yamamoto

Motoi Hatanaka

Futoshi Ohtsuka

Tohru Nakagawa

Kazushi Higashi

In a common chamber () for distributing, to respective pressure chambers (), an ink supplied from the ink inlet (), resistant walls () are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels () that lead to respective pressure chambers (), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (), thereby capturing a solid ingredient () included in the ink. In this case, by adjusting the heights of the resistant walls () to control capabilities of introducing the solid ingredient (), it becomes possible to dispense desired amounts of the solid ingredient () to the respective pressure chamber ().

Inkjet head and coating apparatus using same

An inkjet head, includes: a pressure chamber communicating with an ink flow channel; a diaphragm linked to the pressure chamber; a piezoelectric element linked to the diaphragm; a nozzle communicating with the pressure chamber; and a vibrating mechanism placed in the ink flow channel and vibrates a supplied ink. Further provided is an inkjet device, including: the above inkjet head; a holding unit that holds a coating object; a moving mechanism that causes relative movement between the inkjet head and the holding unit; and a control unit that controls the inkjet head, the holding unit, and the moving mechanism.

Inkjet head and inkjet device

A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate

A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

Growing community of inventors

Hyogo, Japan

Takeshi Kita