Ngk Insulators, Inc.

Takeshi Kaku

Takashi Ebigase

Izumi Masuda

Masayuki Uetani

Kazuyoshi Shibata

Takao Ohnishi

Hideki Shimizu

Takaaki Koizumi

Makoto Tani

Yasutaka Awakura

Hidehiko Tanaka

The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 μm or more and 20 μm or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.

Bonded substrate and bonded substrate manufacturing method

A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 μm. The second main surface extends beyond the extended plane of the first portion by a distance of 10 μm or more.

Bonded substrate and manufacturing method of bonded substrate

Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.

Bonded substrate and method for manufacturing bonded substrate

A piezoelectric device is a fired body including a body partand external electrodesandA surface of the side electrodeis comprised only of a material for the side electrodeOn a surface of the surface electrodeor a surface of a connection portion where the surface electrodeand the side electrodeare connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrodeis provided. A region, on the surface of the surface electrodefarther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrodeis exposed.

Ceramic device and piezoelectric device

A method for manufacturing a ceramic device is provided including fixing a ceramic substrate to a reinforcing plate via a sacrifice layer, forming a groove, which penetrates the ceramic substrate and the sacrifice layer and reaches the reinforcing plate, on an upper surface of the ceramic substrate to divide the ceramic substrate into plural ceramic substrates, and removing the sacrifice layer.

Method for manufacturing ceramic device

A laminated body is provided that exhibits impact resistance, wear resistance and scratch resistance, and which enables a reduction in weight together with a reduction in the dielectric constant. The laminated bodyincludes a first tabular memberconfigured from a ceramic material and having a first thickness t, and a second tabular memberconfigured from a polymer material and having a second thickness t. The laminated bodywithstands a falling-ball impact breaking test from a height that is higher than that exhibited by a single layer body that is configured from the ceramic material and of a thickness tthat is the sum of the first thickness tand the second thickness t

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Komaki, Japan

Takeshi Kaku