Komatsu Corporation

Takeshi Kajihara

Akio Konishi

Katsushi Fukuda

Kenichi Tomita

Yasunori Sato

Kiyoharu Sasaki

Shinichi Fujimoto

Hiroyuki Mizukami

Takeji Kajiura

Kouichi Ishida

Yong Hoon Lee

Keisuke Ikeda

A thermoelectric power module capable of withstanding a long time use in a high temperature environment where a temperature (Th) of a higher temperature portion exceeds 250&#xb0; C. The thermoelectric power module includes: a thermoelectric power element; a first diffusion prevention layer consisting of molybdenum (Mo) and disposed on a surface of the thermoelectric power element; a second diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni&#x2014;Sn) and disposed on a surface of the first diffusion prevention layer opposite to the thermoelectric power element side; an electrode; a third diffusion prevention layer consisting of an intermetallic compound of nickel-tin (Ni&#x2014;Sn) and disposed on a surface of the electrode; a solder layer containing lead (Pb) at not less than 85% and configured to join the second diffusion prevention layer and the third diffusion prevention layer to each other.

Thermoelectric power module

A method of fabricating a thermoelectric element of enhanced thermoelectric performance is provided by improving the preparation of thermoelectric material and employing hot plastic working in combination. The method comprises the step (a) of mixing and heat-melting a raw material of a predetermined composition; the step (b) of turning the heat-melted material into microglobules by either of scattering and spraying, and then quenching the microglobules, thereby providing a globular powdery thermoelectric material; and the step (c) of plastically deforming the thermoelectric material in a hot condition, thereby to bring crystal grains of the thermoelectric material into a crystal orientation affording an excellent figure of merit.

Thermoelectric element, method of fabricating the same, and thermoelectric module employing the same

Powder of a semiconductor material and solvent are packed into a rubber tube and both ends of the rubber tube are fixed by fixing rings in a condition with sealing in the vertical direction effected by an upper cover and a lower cover. After this, the rubber tube is immersed in an oil bath and pressure is applied uniformly from the side faces to the semiconductor material within the rubber tube, using hydraulic pressure. An extrusion molding of rectangular shape and of smaller cross sectional area than before molding is formed by extrusion from an extrusion port of rectangular solid shape of a die (extrusion mold) in which pressure is applied in an extrusion direction D by a punch to a rectangular solid sintered body of thermoelectric semiconductor material.

Thermoelectric semiconductor material, thermoelectric element, method of manufacturing these and method of manufacturing thermoelectric module and device for manufacturing thermoelectric semiconductor material

A thermoelectric semiconductor material having sufficient strength and performance and high production yield. The thermoelectric semiconductor material is characterized in that a sintered powder material of a thermoelectric semiconductor having a rhombohedral structure (or hexagonal structure) is hot-forged and plastically deformed to direct either the crystals of the sintered powder structure or the subcrystals constructing the crystals in a crystal orientation having an excellent figure of merit.

Thermoelectric semiconductor material, manufacture process therefor, and method of hot forging thermoelectric module using the same

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Hiratsuka, Japan

Takeshi Kajihara