Kokusai Electric Corporation

Takeshi Ito

Tomoshi Taniyama

Takayuki Nakada

Daigi Kamimura

Described herein is a technique capable of shortening the time required to reduce the oxygen concentration in a transfer chamber. According to the technique described herein, there is provided a substrate processing apparatus including: a transfer chamber wherein a substrate from a container is transported; a transfer robot configured to transfer the substrate through the transfer chamber; a purge gas supply mechanism configured to supply a purge gas into the transfer chamber; and a pressure control mechanism configured to control an inner pressure of the transfer chamber wherein the pressure control mechanism is provided at an exhaust channel wherethrough an inner atmosphere of the transfer chamber is exhausted, the pressure control mechanism including: an exhaust damper configured to fully open or fully close the exhaust channel; and an adjusting damper provided in the exhaust damper and configured to maintain the inner pressure of the transfer chamber at predetermined pressure.

Substrate processing apparatus and method of manufacturing semiconductor device

There is provided a substrate processing apparatus including: a transfer region communicating with a process chamber where substrates are processed; a first shelf region installed above the transfer region and having a first shelf storing transfer vessels accommodating the substrates; a second shelf region installed below a stage part where the vessels to be transferred to and from an external device are loaded, and having a second shelf stacking and storing the transfer vessels; and a transfer vessel transfer robot installed inside a housing accommodating the transfer region, the first shelf region and the second shelf region and transferring the vessels to and from the stage part, the first shelf, the second shelf, and the transfer region. The transfer vessel transfer robot includes: a main body base part; a first table part; a first driving part; a second table part; a second driving part; and a vessel support part.

Substrate processing apparatus

A substrate processing apparatus includes an accommodating chamber including a loading shelf configured to load a storage vessel that accommodates a substrate; a transfer mechanism installed in a ceiling part of the accommodating chamber and configured to hold an upper portion of the storage vessel and transfer the storage vessel; and a port configured to load and unload the storage vessel to and from the accommodating chamber.

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Toyama, Japan

Takeshi Ito