Fujitsu Corporation

Takeshi Ishitsuka

Koji Tsukamoto

Tetsuzo Yoshimura

Katsusada Motoyoshi

Yasuhiro Yoneda

Wataru Sotoyama

Satoshi Tatsuura

Yasuo Yamagishi

Shigenori Aoki

Motoaki Tani

Azuma Matsuura

Nawalage Florence Cooray

Tomoaki Hayano

Youko Kuramitsu

Tsuyoshi Yamamoto

Nobuyuki Hayashi

Masayuki Kitajima

Akihiro Mochizuki

Hideki Kitada

Haruhisa Soda

Aki Dote

Satoshi Emoto

Hiroyuki Machida

A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.

Semiconductor device

A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Circuit board with kneaded conductive paste

A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof

A multilayer printed wiring board includes a core member having a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240&#xb0; C.

Multilayer printed wiring board

An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.

Optical circuit system and components of same

A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH)

An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.

Optical circuit device, its manufacturing process and a multilayer optical circuit using said optical circuit device

Optical circuit system and components of same technical field

A method of forming waveguides, refractive index distributions and optical couplings automatically by light incidence, and devices obtained thereby. A non-linear optical material which has excellent properties of a large degree of freedom for an optical circuit substrate composition, etc. is used for optical circuit devices and optical circuit substrates. A photoelectric device containing an organic conjugated polymer film is deposited on a substrate by vapor deposition polymerization as at least one function layer. An optical network is provided with optical wiring for exchanging signals between processing elements selected from electronic elements, electronic apparatuses, electrooptical elements and electrooptical apparatuses.

Method of producing optical waveguide system, optical device and optical

A method of coupling optical parts including bonding the optical coupling faces of two optical waveguides by butting and fusing them. Also, a method for forming a refractive-index distribution having the focusing lens effect by setting the interval between the optical coupling faces of two optical parts to 0.1 mm or more, feeding a refractive-index imaging material also serving as an adhesive into the gap between the faces, and applying light to the refractive-index imaging material from the optical coupling face of at least one of the optical parts.

Method of coupling optical parts and method of forming a mirror

Optical circuit device, its manufacturing process and a multilayer

A method of forming a mirror in a waveguide, including the steps of forming a layer constituting a waveguide in a substrate and forming a mirror-finished surface at a boundary between a portion irradiated with radiation and a non-irradiated portion by obliquely irradiating a layer constituting the waveguide with radiation. The waveguide may be composed of a photosensitive material, and either the irradiated area on the non-irradiated area may be removed by solvent. The waveguide may be composed of a refractive index imaging material in which a refractive index distribution is formed by irradiation with radiation or the refractive index may be increased by heating the irradiated portion. The refractive index imaging material may include a catalyzer to assist in increasing the refractive index distribution of the irradiated area.

Method of forming a mirror in a waveguide

A refractive-index imaging material which includes a binder made of either of a copolymer having acrylic epoxy, chain epoxy, organic denatured silicone, and ethylene unsaturated compound having a hydroxyl group in its end in the building block of the copolymer and a copolymer having any one of ethylene unsaturated compounds containing silicone in the building block of the copolymer, a photosensitive monomer made of a mixture including multifunctional acrylate or multifunctional methacrylate and an ethylene unsaturated monomer containing an aromatic ring or halogen and a photopolymerization initiator.

Refractive index imaging material

An active optical circuit sheet or active optical circuit board wherein an electro optical switch or optical modulator is driven with a voltage (SIGin) from an electronic device, the electrical signal (SIGin) is converted to an optical signal, transmitted and then converted to an electrical signal (SIGout) at an optical receiver element, and an electrical connection is formed between an optical wiring board and the electronic device for transmission of signals to another or the same electronic device, separating the electrical wiring at the electronic device end and the optical wiring at the optical wiring board end, or alternatively, SIGin and SIGout electrode pads are provided on the side of the optical wiring board on which the optical device is mounted or on the opposite side, for connection with the electronic device.

Active optical circuit sheet or active optical circuit board, active

An optical integrated circuit wherein the waveguide network is constructed of a passive waveguide and a functional material is used on the functional portions, an optical circuit device which uses transparent electrodes, an optical switch which uses transparent electrodes and a functional portion made of a non-linear optical material, a matrix optical switch which converts inputted and outputted light at an electrical/optical converter element, and an optical integrated circuit or optical circuit device prepared by selective vapor growth of a functional material on desired regions, as well as an organic film growth process by which an organic film is selectively grown on recess walls and an organic film formation process whereby organic CVD or MLD is performed using a chamber divided into multiple regions.

Growing community of inventors

Kawasaki, Japan

Takeshi Ishitsuka