Hitachi Techno Engineering Co., Ltd.

Takeshi Ishida

Tokinobu Furukawa

Kazuo Takahashi

Takehiko Hayashi

Hideaki Yamamoto

A film laminating apparatus attaches films to electronic circuit boards, such as printed circuit boards and silicone boards or wafers. The film laminating apparatus conveys a plurality of boards at intervals, forms pieces of lamination film at the intervals of the boards on a base film with a processing area between boards and continuously conveys the base film into a reduced-pressure chamber having a board loading port, a film loading port, a laminating mechanism for attaching the lamination film on the base film to the boards, and a board unloading port for ejecting the laminated boards. Shutters are provided for opening and closing shutter sections provided in the board loading port and the board unloading port of the reduced-pressure chamber, and a vacuum source is provided for evacuating the reduced-pressure chamber when the reduced-pressure chamber is closed by the shutters. A shutter section is equipped with a shutter in the film loading port of the reduced-pressure chamber, and a detector is provided for detecting when a processing area in the film between boards being fed into the reduced-pressure chamber is in the shutter section of the film loading port. A control means then operates the shutter means of the film loading port, the board loading port, and the board unloading port to close the reduced-pressure chamber according to the result of detection by the detecting means, and actuates the vacuum source to evacuate the reduced-pressure chamber to a desired degree of vacuum. Then, the laminating means is actuated.

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Kudamatsu, Japan

Takeshi Ishida