Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Takeshi Iseki

Shogo Nakayama

Hideaki Tokunaga

Seiji Tsuda

Takashi Morino

Kenji Nozoe

Hiroyuki Yamada

Kazutoshi Matsumura

Kouichi Yoshioka

Shuji Ariga

Hirotoshi Watanabe

Osamu Makino

Yasuharu Kinoshita

Shoji Hoshitoku

Yuji Yasuoka

Mitsuaki Nakao

Naohiro Mikamoto

Fuyuki Abe

Toshifumi Suejima

Mitsuo Ioka

Akimitsu Fujii

Kazutosi Matumura

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Resistor and method for manufacturing same

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

Resistor

In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.

Resistor and manufacturing method for same

An overvoltage protector includes a first discharging electrode, a second discharging electrode, and an overvoltage protection part provided between the first and second discharging electrodes. The overvoltage protecting part has an insulating property under a normal operation condition, and has a conductive property if an overvoltage is applied between the first and second discharging electrodes. The overvoltage protecting part is made of a mixture of resin having an insulation property, an inorganic compound having an insulating property, and metallic boride compound powder. The metallic boride compound powder has a high melting point therefore it is hardly melted. Under high temperatures causing the powder to melt, the powder is oxidized and loses conductivity, thus providing a high reliability.

Overvoltage protection component, and overvoltage protection material for overvoltage protection component

A conductive layer mainly made of gold is formed on an upper surface of an insulating substrate. Plural electrodes facing each other via a gap is formed by forming the gap in the conductive layer. An overvoltage protective layer covering the gap and a portion of each of the plurality of electrodes is formed. This method can provide the gap with a narrow width precisely, and thereby, provide an electrostatic (ESD) protector with a low peak voltage, stable characteristics of suppressing electrostatic discharge, and a high resistance to sulfidation.

Anti-static part and its manufacturing method

The static-electricity control part of the present invention contains multiple pairs of backside electrodes () provided on both end portions () of a long-edge-side at the backside of insulating substrate (); multiple pairs of top electrodes () provided on both end portions () of a long-edge-side at the top face of insulating substrate (); top ground electrode () provided on the top face of insulating substrate () from its short-edge-side one end portion () to other end portion (); overvoltage protection material layer () for filling gap () formed between any one of the multiple pair pairs of top electrodes () and top ground electrode (); and backside wiring () provided on the backside of insulating substrate () so as to connect between the multiple pairs of backside electrodes ().

Static electricity control part and process for manufacturing the same

A chip resistor includes: a pair of upper surface electrodes formed at opposing side portions of a rectangular substrate as opposed to each other with respect to a center line of the rectangular substrate extending in a direction connecting the side portions; a resistive element formed on the rectangular substrate to be electrically connected with the upper surface electrode pair; and a pair of end surface electrodes formed on end surfaces of the opposing side portions of the rectangular substrate and electrically connected with the upper surface electrode pair. The chip resistor further includes dummy electrodes formed individually at the opposing side portions of the rectangular substrate at positions corresponding to the upper surface electrode pair in the direction connecting the side portions.

Chip resistor, and its manufacturing method

The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming portion. At least one of the rectangular sections is trimmed to adjust the resistance. According to the construction of the present invention, a compact resistor of superior surge property can be obtained.

Resistor and method of manufacturing the same

An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Electronic component and method of manufacturing the same

The present invention is directed towards a resistor which has higher load-, surge-, and pulse-resistant characteristics and is capable of having a resistance adjusted at a higher rate of precision. A pair of electrodes 12 and a main resistance path 13 between the two electrodes 12 are mounted on a substrate 11. The main resistance path 13 is joined to a set of first rungs 14 which extend parallel to the main resistance path 13 and are joined with two first connecting paths 15 to form a first ladder-like resistance path for rough adjustment of the resistance which is connected to a part of the main resistance path 13. Also, a second ladder-like resistance path for fine adjustment of the resistance which comprises a set of second rungs 16 extending vertically from the main resistance path 13 and two second connecting paths 17 joining the second rungs 16 together is formed and connected to a part of the main resistance path 13. A combination of the two ladder-like resistance paths of a resistive body for rough and fine adjustments of the resistance permits a desired resistance to be set at a higher precision thus providing the higher load-, surge-, and pulse-resistant characteristics of a resultant resistor. Alternatively include first and second resistance paths 20 and 21 without rungs for similar rough and fine adjustment.

Resistor and method of making the same

The invention relates to glaze resistors which are used for electronic parts of hybrid integrated circuit devices, chip resistors, resistor network, etc. The glaze resistor comprises 4.0 to 70.0 wt % of a conductive component composed of a metal silicide and a metal boride and 30.0 to 96.0 wt % of glass in which a rate of said metal boride is 1.0 to 68.0 wt %. Thus, the glaze resistor can be formed by sintering in a non-oxidizing atmosphere and can provide a circuit, together with conductor pattern of base metals such as Cu.

Growing community of inventors

Fukui, Japan

Takeshi Iseki