Funai Electric Company Ltd.

Funai Electric Advanced Applied Technology Research Institute Inc.

National Institute of Advanced Industrial Science and Technology

Taiwan Semiconductor Manufacturing Comp. Ltd.

Onpa Technologies Inc.

Takeshi Inoda

Fuminori Tanaka

Ryusuke Horibe

Toshimi Fukuoka

Rikuo Takano

Masatoshi Ono

Kiyoshi Sugiyama

Shigeo Maeda

Hideki Choji

Shuji Umeda

Yuichiro Masuda

Mika Hamaoka

Jun Akedo

Ken Nishioka

Akira Funatsu

Michitomo Shibutani

Tomio Ishida

Syuzi Umeda

Tomohiro Taniguchi

Hideki Chouji

Toru Takahashi

Hiroshi Okuno

Ono Masatoshi

The optical scanning device includes a swingable reflector; a blocking unit that is provided in the reflector to move in linkage with the reflector; and a sensor unit that includes at least a first sensor unit and a second sensor unit, wherein each of the first and second sensor units includes an output unit, which is a light generator or an electromagnetic wave generator configured to output a detection target and a detection unit, which is a light receiver or an electromagnetic wave receiver configured to detect the detection target. The output unit is at a position that faces the detection unit. When the reflector is in a predetermined swing angle range, the blocking plate blocks a path of the detection target between the output unit and the detection unit.

Optical scanning device in optical scanning device

Provided is an optical scanning device. The optical scanning device includes a swingable reflection unit; a blocking unit that is provided in the reflection unit to move in linkage with the reflection unit; and a sensor unit that includes an output unit configured to output a detection target and a detection unit configured to detect the detection target, wherein, when the reflection unit is in a predetermined swing angle range, the blocking unit blocks a path of the detection target between the output unit and the detection unit.

Optical scanning device and method of detecting angle of reflection unit in optical scanning device

An oscillating mirror element includes a mirror portion, a drive portion that drives the mirror portion, a strain sensor capable of detecting an amount of displacement of the mirror portion, and a base including a mirror beam portion provided with the mirror portion, a sensor beam portion provided with the strain sensor, and a body portion that supports the mirror beam portion and the sensor beam portion and is provided with the drive portion.

Oscillating mirror element and projector

An optical scanning device includes a support portion including a swingable coupling portion and a frame swingably supporting the coupling portion, a first reflecting portion coupled to the coupling portion and configured to swing together with the coupling portion, and a swingable connecting portion including a bridge and a second reflecting portion coupled to the first reflecting portion via the bridge and provided at a position away from the first reflecting portion beyond the support portion.

Optical scanning device

A microphone unit includes first and second diaphragms; a substrate on a top surface of which are installed the first and second diaphragms; and a cover disposed covering the first and second diaphragms, the cover joined to an outside edge of the substrate and forming an internal space. There are formed in the substrate first and second openings that are formed respectively in the top and bottom surfaces of the substrate, and an internal sound path communicating from the first opening to the second opening. The first diaphragm is disposed on the substrate so as to cover and hide the first opening. The second diaphragm is disposed so as to seal off a partial region away from the first opening of the top surface of the substrate. A third opening is formed in the cover, and the internal space communicates to an outside space via the third opening.

Microphone unit, and sound input device provided with same

A microphone unit includes a microphone substrate. A plurality of diaphragm units are disposed on the microphone substrate. Each of the diaphragm units includes a diaphragm. A plurality of partition walls are disposed on the microphone substrate. Each of the partition walls surrounds the diaphragm so as to define a first area. A signal processor is disposed at a second area outside the first area and is configured to process signals output from the diaphragm units.

Microphone unit having a plurality of diaphragms and a signal processing unit

A microphone unit () is provided with an electro-acoustic transducer () which converts acoustic signals into electric signals on the basis of the oscillation of a diaphragm (), and a housing () which contains the electro-acoustic transducer (). The housing () is provided with: a first sound conduction space (SP) that guides sound waves from the outside to one side of the diaphragm () via at least one first aperture () formed on the exterior of the housing (); and a second sound conduction space (SP) that guides sound waves from the outside to the other side of the diaphragm () via at least one second aperture () formed on the exterior of the housing (). The total square area of at least one first aperture () and the total square area of at least one second aperture () are not the same.

Microphone unit

An integrated circuit device includes a circuit board ('), the circuit board including a first diaphragm (-) that forms a first microphone, a second diaphragm (-) that forms a second microphone, and a differential signal generation circuit () that receives a first voltage signal obtained by the first microphone and a second voltage signal obtained by the second microphone, and generates a differential signal that indicates a difference between the first voltage signal and the second voltage signal.

Integrated circuit device, voice input device and information processing system

A microphone unit () comprises a first vibrating part (), a second vibrating part (), and a housing () for accommodating the first vibrating part () and the second vibrating part (), the housing being provided with a first sound hole (), a second sound hole (), and a third sound hole (). The housing () is provided with a first sound path () for transmitting sound pressure inputted from the first sound hole () to one surface () of a first diaphragm () and to one surface () of a second diaphragm (), a second sound path () for transmitting sound pressure inputted from the second sound hole () to the other surface () of the first diaphragm (), and a third sound path () for transmitting sound pressure inputted from the third sound hole () to the other surface () of the second diaphragm ().

Microphone unit and voice input device comprising same

A microphone unit includes a case; a diaphragm arranged inside the case; and an electric circuit unit that processes an electric signal generated in accordance with vibration of the diaphragm. The case has a first sound introducing space that introduces a sound from outside of the case to a first surface of the diaphragm via a first sound hole; and a second sound introducing space that introduces a sound from outside of the case to a second diaphragm, via a second sound hole. A resonance frequency of the diaphragm is set in the range of &#xb1;4 kHz based on the resonance frequency of at least one of the first sound introducing space and the second sound introducing space.

An enclosure () of a microphone unit () includes a mounting portion () which has a mounting surface () where a first vibration portion () and a second vibration portion () are mounted and in which, in the back surface () of the mounting surface (), a first sound hole () and a second sound hole () are provided; in the enclosure (), a first sound path () is provided that transmits sound waves input through the first sound hole () to one surface of a first diaphragm () and that also transmits the sound waves to one surface of a second diaphragm () and a second sound path () is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm ().

Microphone unit and sound input device incorporating same

There is provided an integrated circuit device having a wiring board', the wiring board&#x2032; including: a first vibrating membrane-which forms a first microphone; a second vibrating membrane-which forms a second microphone; and a differential signal generating circuitwhich receives a first voltage signal obtained in the first microphone and a second voltage signal obtained in the second microphone and generates a differential signal indicating a difference between the first and second voltage signals, and a voice input device and an information processing system including the same. Accordingly, it is possible to realize a voice input element having a small size and a noise removal function with high accuracy.

A microphone unit () comprises a first vibrating part (), a second vibrating part (), and a case () for accommodating the first vibrating part () and the second vibrating part (), the case being provided with a first sound hole () and a second sound hole (). The case () is provided with a first sound channel () for transmitting acoustic pressure inputted from the first sound hole () to one surface () of a first diaphragm () and to one surface () of a second diaphragm (), a second sound channel () for transmitting acoustic pressure inputted from the second sound hole () to the other surface () of the second diaphragm (), and a sealed space (S) that faces the other surface () of the first diaphragm ().

A microphone unit converts voice into an electric signal based on the vibration of a diaphragm contained in an MEMS chip. The microphone unit includes a substrate on which the diaphragm is mounted (the MEMS chip is mounted); a cover member, having sound holes, that is disposed above the substrate so that the diaphragm is contained within the inner space formed between the cover member and the substrate; and a holding member that holds only the substrate or both of the substrate and the cover member.

Microphone unit and voice input device using same

Disclosed is a microphone unit comprising a film substrate (), electrically conductive layers () which are formed on both substrate surfaces of the film substrate (), and an electrical acoustic transducer unit () which is provided on the film substrate () and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (), including the electrically conductive layers (), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.

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Osaka, Japan

Takeshi Inoda