Murata Manufacturing Co., Ltd.

Takeshi Inao

Yutaka Takeshima

Masanobu Nomura

Toru Nishikawa

Yuichiro Tokunaga

Takashi Iwamoto

Tatsuhiko Aizawa

A radio-frequency module includes a module substrate, an inductor, and an acoustic wave filter. The inductor overlaps at least a portion of the acoustic wave filter when seen in a plan view from the normal direction of the module substrate. The inductor includes first and second coils connected in series. Each of the first and second coils is a spiral or helical coil that is wound with more than one turn. At least a portion of the first coil overlaps the second coil when seen in a plan view from the normal direction of the module substrate. A direction of a magnetic field generated by the first coil is opposite to a direction of a magnetic field generated by the second coil.

Radio-frequency module

A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Thin-film capacitor having a connecting part of a lead conductor disposed within an opening in a protective layer

Thin-film capacitor

A method for measuring a film strength of a film on an object. An incident angle of pressure waves with respect to an object to be measured, the object including a base coated with a film, is set for applying the pressure waves to the object. The incident angle is varied over a range including a critical angle &#x3b8;cr. The object generates surface waves, in response to the pressure waves, at and near the critical angle. In response to the surface waves, the object generates leaky waves, which are pressure waves caused by the surface waves. The intensity of pressure waves including reflected waves and leaky waves from the object are measured. A received intensity Vat an incident angle where no leaky wave is generated, and the intensity difference Vbetween Vand the received intensity at the critical angle &#x3b8;cr when the film strength is high are measured. An intensity difference Vbetween Vand the received intensity when the intensity of the leaky waves remains unchanged, regardless of the changes in the incident angle, within the range where the leaky waves are generated, which indicates a low film strength, is also measured. Thus, the film strength is determined based on V, V, and V.

Methods for measuring strength of film and determining quality of object having the film

A polishing apparatus is provided for accurately detecting the relative displacement between an upper wheel and a lower wheel and thus for reliably polishing workpieces to a desired thickness. The polishing apparatus includes an upper wheel for pressing at least one workpiece, a lower wheel for supporting the workpiece, non-contact-type displacement-detection device for detecting the relative displacement between the upper wheel and the lower wheel, and a reference table for providing a displacement-detection reference position. The non-contact-type displacement-detection device is joined to the upper wheel so as to move therewith. The reference table is disposed at a position opposing the displacement-detection device and also is integrally connected to the lower wheel.

Polishing apparatus

A slicing method and slicing apparatus eliminate occurrence of cracking and/or chipping of a to-be-machined object without reducing the processing speed thereof. To this end, the slicing method comprising cutting the to-be-machined object W by supporting the to-be-machined object W on a table,and causing this table,to travel in an x-axis direction while allowing a slicing blade,to rotate at a predetermined position. A sensor,detects a variable load F that the to-be-machined object receives during slicing and an actuator,operatively responds to receipt of a detection signal of the sensor,The actuator,forces the to-be-machined object W to deform in a direction which permits reduction of the aforesaid variable load F. The actuator is provided between the sensor,and table,or alternatively between the to-be-machined object W and sensor

Slicing apparatus

A slicing method and slicing apparatus eliminate occurrence of cracking and/or chipping of a to-be-machined object without reducing the processing speed thereof. To this end, the slicing method comprising cutting the to-be-machined object W by supporting the to-be-machined object W on a table 10 and causing this table 10 to travel in an x-axis direction while allowing a slicing blade 20 to rotate at a predetermined position. A sensor 12 detects a variable load F that the to-be-machined object receives during slicing and an actuator 11 operatively responds to receipt of a detection signal of the sensor 12. The actuator 11 forces the to-be-machined object W to deform in a direction which permits reduction of the aforesaid variable load F. The actuator is provided between the sensor 12 and table 10, or alternatively between the to-be-machined object W and sensor 12.

Slicing method for adjusting a force applied to an object

A wire 10 made of metal is shaped into a wire having a diameter of 5 mm by a circular die 12 and then, cut to a plurality of lengths of 500 mm. The wire 10 is heated in hydrogen atmosphere at 800.degree. C. for two hours. Then, the wire 10 is drawn by a plurality of triangular dies 14, 16, 18, and 20 sequentially without winding the wire 10 around a reel. As a result, the wire 10 is shaped into an approximately regular triangular configuration in section. The wire 10 shaped into the approximately regular triangular configuration is cut to a plurality of lengths of 40 mm and then supplied to a predetermined place for a subsequent processing.

Method for manufacturing a vibrator

Optimum conditions for extrusion forging by using a powder material are determined by making a cylindrical billet out of the powder material, subjecting it to a deformation stress between plates to measure its strain as well as the time-rate of change in the strain, thereby determining parameters in the stress-strain formula, and carrying out a simulation analysis by an arbitrary Lagrangian-Eulerian method with an equation of motion obtained by the principle of virtual power. In considering the virtual power, bulk work is also taken into consideration. By such simulation analysis, data such as pressure distribution, speed distribution and density distribution are obtained. Optimum conditions are obtained by analyzing these data.

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Konan, Japan

Takeshi Inao