Hitachi, Ltd.

Takeshi Hizono

Hironori Oikawa

Kazuaki Tanaka

Katsuya Sato

Masayuki Saeki

An electronic apparatusin which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold framefor holding the electronic unit, a first heat-conducting memberfor transmitting heat generated by the first heat-generating section, a second heat-conducting memberfor transmitting heat generated by the second heat-generating section, and a cooling unitfor releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting memberis heat-connected to the cooling unit, and the second heat-conducting memberis heat-connected to the cooling unitvia the hold frame

Cooling system for an electronic unit with plural heat-generating sections

In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.

Electronic device having a heat dissipation member

In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.

Growing community of inventors

Yokohama, Japan

Takeshi Hizono