Kao Corporation

Fujikura Limited

Nikon Corporation

Sumco Corporation

Mitsubishi Materials Silicon Corporation

Kabushiki Kaisha Toshiba

Nec Corporation

Tokyo Institute of Technology

Konami Digital Entertainment Co., Ltd.

Nippon Hoso' Kyokai

Contec Corporation

The Yoshida Dental Mfg. Co., Ltd.

Kyoei Electric Co., Ltd.

Ricoh Company, Ltd.

Mitsubishi Jidosha Kogyo Kabushiki Kaisha

Takeshi Hasegawa

Hiroyuki Shiraki

Koichi Hatano

Motoi Ueda

Manabu Shibata

Yoshinobu Nakada

Yasuo Takemura

Hiroshi Harada

Shinichi Watanabe

Hideki Kawamura

Kentaro Hara

Toshio Nozaki

Ken Goto

Keiji Ohmura

Tadao Abe

Kiyoshi Numazaki

Yoshiyuki Eshita

Akira Yoshihara

Yasunori Miyamoto

Atsushi Hamada

Mitsuru Kunii

Terumi Ito

Hironobu Otani

Naritoshi Shimada

Takaaki Shiota

Manabu Tonomura

Ichiro Terunuma

Kazuya Akashi

Yoshiro Oikawa

Atsushi Momota

Shin Tsuchiya

Michizo Yamanaka

Haruo Isono

Yusuke Kido

Naoki Goshima

Mikio Okamoto

Hideaki Shimomura

Moritaka Gotoh

Katsunori Onuki

Toshikazu Munemasa

Naotaka Shimamura

Nozomu Nakanishi

Wataru Itou

Makoto Katoh

Toshiaki Umemura

Kenichirou Takahashi

Kazuo Enomoto

Hidetaka Yamazaki

Taketaro Doi

Yoshio Sunami

Hideo Kusaka

Yuitsu Sakuraba

Yoshifumi Hatakeyama

Fuminobu Hongo

Mitsuhiko Murata

M c/o Kyoei Print Industry Co Ltd Katoh

Y c/o Kyoei Electric Co Ltd Hatakeyama

Yasuo c/o Fujikura Ltd Takemura

H c/o Kyoei Print Industry Co Ltd Harada

A handpiece with a built-camera includes a micromotor-driven handpiece body which includes a cutting tool attached to a head portion thereof, a light receiving port at a position near the cutting tool, a grip portion detachably connected to the handpiece body and a color camera module which is stored inside the handpiece body. The handpiece with the built-in camera further includes an objective lens which faces the light receiving port and a rod fiber which is attached to an inner wall portion of the handpiece body with an incidence end of the rod fiber facing the objective lens and an exit end of the rod fiber facing a condensing lens unit.

Handpiece with built-in camera and dental treatment method using handpiece

Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.

Method of manufacturing a rigid printed wiring board

A spectrometric analyzing device is capable of analyzing a thin film with high accuracy by using light having an arbitrary wavelength, such as not only infrared light but also visible light, ultraviolet light and X-ray, and using whatever refractive index of a supporting member of the thin film. A spectrometric analyzing device comprises a light source (), a polarizing filter (), a detection unit (), a regression operation unit () and an absorbance spectrum calculation unit (). The light source () emits light at n different angles of incidence (&#x3b8;) to a measurement portion. The polarizing filter () shields an s-polarized component. The detection unit () detects transmitted spectra (S). The regression operation unit () uses the transmitted spectra (S) and a mixing ratio (R) to obtain an in-plane mode spectrum (s) and an out-of-plane mode spectrum (s) through a regression analysis. The absorbance spectrum calculation unit () calculates an in-plane mode absorbance spectrum (A) and an out-of-plane mode absorbance spectrum (A) of the thin film, based on the results from a state in which the thin film is on the supporting member and a state in which no thin film is on the supporting member.

Spectrometric analyzing device and spectrometric analyzing method

Provided is a network game system for providing a game played by players of game machines by operating at least one of the game machines as a server, in which: the game machine to be operated as a server can be appropriately selected; a measuring unit () of each of the game machines () measures a time required to exchange predetermined data between the game machine () and another game machine () of the game machines (); and a server determining unit () determines at least one of the game machines () as the game machine () to be operated as the server according to the results of the measurement by the measuring units () of the game machines ().

Network game system, game machine, game machine control method, and information storage medium

In this heat treatment jig and method for silicon wafers, a silicon wafer is heat-treated while being mounted on support projections provided on three support arms, having an intervening spacing, protruding from a support frame towards the center. At that time, all the support projections under the silicon wafer are positioned on a same circle within a region where a radial distance from the center is defined by 85 to 99.5% of the wafer radius, and the support arms form an angle of 120&#xb0; with each other about the center. With this jig and method, free depth of a dislocation generated from a pin position can be controlled deeper than a device formation region, and a widest slip-free region where the surface is free from slip dislocation is obtained.

Heat treatment jig and heat treatment method for silicon wafer

There is provided a silicon wafer surface defect evaluation method capable of readily detecting a region where small crystal defects exist, the evaluation method comprising: a rapid heat treatment step of a silicon wafer from a silicon single-crystal ingot in an atmosphere which can nitride silicon at a temperature elevating speed of 10 to 150&#xb0; C./second from a room temperature to temperatures between not lower than 1170&#xb0; C. and less than a silicon melting point, holding the silicon wafer at the processing temperature for 1 to 120 seconds and then cooling the silicon wafer to the room temperature at a temperature lowering speed of 10 to 100&#xb0; C./second; and a step of using a surface photo voltage method to calculate a minority carrier diffusion length on the wafer surface, thereby detecting a region on the wafer surface in which small COP's which cannot be detected at least by a particle counter exist.

Silicon wafer surface defect evaluation method

In a method of producing aerated soap () comprising solidifying molten soap () having a large number of bubbles dispersed therein in a cavity () of a mold (), the cavity () having a prescribed shape, 1.05 or more time as much molten soap () as the volume of the aerated soap () is fed to the cavity () and solidified in a compressed state.

Method of producing aerated soap

Small-sized motor

An apparatus for producing a soap cake comprising a mold which has a cavity of prescribed shape, a feed passage for feeding molten soap to the cavity, and means for pushing molten soap remaining in the feed passage at the time of feeding molten soap to the cavity to remove molten soap remaining in the feed passage. One end of the feed passage is a gate, in which a gate pin for shutting the connection between a feed port and the cavity is slidably provided. As the gate pin advances, molten soap remaining in the feed passage is removed in the step of feeding molten soap to the cavity.

Apparatus and method for producing soap cake

A management server receives from a server storing information a request that a data input job be executed and from a data input device a request to assign a data input job to itself. The management server makes a list of information to be digitized through data input, based on information held on itself and input-specific information obtained from the server storing information, and transmits the list to a data input device adequate to the data input job. The data input device selects information as data input preference. The data input device obtains the selected information from the server storing information. Through the data input device, its operator inputs the obtained information as computer-usable data. The input data is transmitted to the server storing information. The management server stores, updates, and manages diverse data about input jobs.

System allowing data input device to request management server to assign a data input job to itself

Method of manufacturing soap with air bubbles

A method of producing aerated soap comprising solidifying molten soap having bubbles dispersed therein in a molding unit, wherein a storage tank of the molten soap has a circulating duct forming a loop passing through the storage tank , and the circulating duct or the storage tank has connected thereto a feed nozzle for feeding the molten soap , whereby the molten soap is fed to the molding unit through the feed nozzle while being circulated in the circulating duct

A first chopper between a laser device and a semiconductor substrate chops an excitation light at a specific frequency, and a second chopper between the first chopper and the semiconductor substrate chops the excitation light at a variable frequency higher than the first chopper. A photoluminescence light emitted by the semiconductor substrate when the semiconductor substrate is intermittently irradiated with the excitation light is introduced into a monochromator. A controller obtains the decay time constant T of the photoluminescence light from variation of the average intensity of the photoluminescence light when gradually increasing the chopping frequency of the excitation light by controlling the second chopper, and computes the life time &tgr; of the semiconductor substrate from an expression &ldquo;&tgr;&equals;T/C&rdquo;, where C is a constant. An object of the invention is to accurately evaluate impurities, defects and the like in a semiconductor substrate by obtaining quantitatively the life time of the semiconductor substrate having a long life time.

Method for evaluating the quality of a semiconductor substrate

A wire harness includes a flat cable having a trunk portion formed by covering a plurality of parallel electric wires with an insulating coating by integral molding, a plurality of branch portions formed by branching the trunk portion, and a joint device for connecting not less than two electric wires of the plurality of electric wires constituting the trunk portion to electrically short-circuit the branch portions. A wire harness manufacturing method includes the step of tearing an end portion of a trunk portion of a flat cable in accordance with the number of branch portions required, and cutting off unnecessary portions, thereby forming branch portions, the trunk portion being formed by covering a plurality of electric wires with an insulating coating by integral molding, the step of mounting a connector on the distal end of each branch portion, and the step of mounting a joint device on the trunk portion to electrically short-circuit not less than two electric wires of the electric wires of the trunk portion.

Wire harness and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Takeshi Hasegawa