Kabushiki Kaisha Toshiba

Takeshi Hanawa

Takeshi Miyagi

Kunio Yoshihara

Yuji Iseki

Yasushi Shizuki

Eiji Takagi

Kazuhito Higuchi

Kouhei Morizuka

Motoyasu Morinaga

Mitsuo Konno

Yasuo Ashizawa

Junko Akagi

Yasuhiro Kuriyama

Disclosed is an ultra high frequency radio communication apparatus having: a receiver antenna; a transmitter antenna; an IC chip being electrically connected to the receiver antenna and the transmitter antenna; a substrate on which the receiver antenna, the transmitter antenna and the IC chip are mounted; an input terminal for inputting to the IC chip a base band input signal; an output terminal for outputting a base band output signal from the IC chip; and a control signal terminal for inputting a control signal for controlling the IC chip to the IC chip. The IC chip is placed in a shielding space such that the cut-off frequency of the shielding space is higher than the frequency of a carrier signal for radio communication.

Ultra high frequency radio communication apparatus

A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for forming a wiring therein, and a signal wiring formed in the U-shaped groove, which is featured in that an upper end portion of the signal wiring is protruded out of the surface of the dielectric layer. A distance (H) from a protruded top surface of the signal wiring to a bottom of the U-shaped groove and a width (W) of the U-shaped groove preferably meet a relationship of 2&lt;(W/H)&lt;50, and the height of the portion of signal wiring which is protruded out of the surface of the dielectric layer is preferably in the range of 10 nm to 10 .mu.m.

Wiring board for high-frequency signals and semiconductor module for

Growing community of inventors

Yokohama, Japan

Takeshi Hanawa