Fujitsu Corporation

Takeshi Hamano

Darren Kim

Kevin Seichi Yamada

Ashok Vasudeo

Nobuyuke Koike

Manu Pillai

Isamu Yamada

Samir Sathe

A notebook computer comprises a plurality of conventional sensors disposed on the notebook computer to achieve a wide-angle infrared sensor response. An infrared input device comprises a mouse and a touchpad with an improved energy management system to reduce power consumption and a user settable identification code to prevent crosstalk with other infrared devices.

Notebook computer with detachable infrared multi-mode input device

A combined electromagnetic interference (EMI) shield and heat dissipation is comprised of a five-sided receptacle coupled to a heat spreading plate. The receptacle is composed of a shield material having an insulated interior coating. A compact, low profile assembly to house the motherboard of notebook computer achieves a significant reduction in vertical thickness by combining the functions of an EMI shield and heat dissipation structure.

Low profile EMI shield with heat spreading plate

A notebook computer comprises a plurality of conventional sensors disposed on the notebook computer to achieve a wide-angle infrared sensor response. An infrared input device comprises a mouse and a touchpad with an improved energy management system to reduce power consumption and a user settable identification code to prevent cross-talk with other infrared devices.

The apparatus provided with a heatsink ( ) being in contact with an electronic component ( ), a heat radiation plate ( ) for radiating heat, a heat conduction member ( ) for transferring heat in the heat sink to the radiation plate, and connection mechanisms ( - and - ) for connecting the heat sink and the heat conduction member and separating the heat sink and the heat conduction member. This connection mechanism enables to maintain small heat conduction resistance between the heat sink and the electronic component and also between heat sink and heat conduction member. Cooling capability can be prevented from decreasing even when the heat sink and the heat conduction member is of separated construction.

Cooling mechanism, heat sink, electronic equipment and fabrication method therefor

A module which may be connected to an I/O port of a notebook computer to provide an enhancement to the number of connectivity options available to a user of the computer. The module houses a set of connectors, some or all of which may be specialized ones not normally found on the computer. The connectors are electrically connected to an I/O port of the computer by a flexible cable that allows the module to be easily positioned or re-positioned by the user. The flexibility of the connection allows the user to easily satisfy the line of sight requirement when using the infrared port for data transmission.

Growing community of inventors

Zama, Japan

Takeshi Hamano