Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Takeshi Furukawa

Yasuhiro Tamatani

Koshi Himeda

Kazutoyo Horio

Kazuya Kusuda

Tatsuya Kitamura

Akitomo Takahashi

Atsushi Yamamoto

Kenji Nishiyama

Shinji Otani

Koji Fujimoto

Tatsuya Funaki

Katsutomo Aritomi

Shinya Kiyono

Chiharu Sakaki

Sho Fujita

Kinya Aoki

Kazutaka Nakamura

Kohei Shimada

Takeo Arakawa

Yoshihiro Fujita

Masahiro Matsuo

Yuji Yokoyama

Sachiko Shirakawa

Hideo Ito

Misato Miyake

Takaaki Sakai

Daisuke Obara

A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.

Module

A capacitor element that includes: a capacitor portion including an anode plate having a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a first cathode through conductor and a second cathode through conductor each penetrating the dielectric layer and the anode plate in a thickness direction and electrically connected to the cathode layer; and an anode through conductor penetrating the dielectric layer and the anode plate in the thickness direction and electrically connected to the anode plate, wherein, in a plan view from a thickness direction of the anode plate, a first center-to-center distance between the first anode through conductor and the first cathode through conductor is equivalent to a second center-to-center distance between the first anode through conductor and the second cathode through conductor.

Capacitor element, module, and semiconductor composite device

A solid electrolytic capacitor element that includes: an anode plate having a first main surface and a second main surface which oppose each other in a thickness direction thereof, and made of a valve-action metal; a porous layer on at least one main surface of the anode plate; a dielectric layer on a surface of the porous layer; a cathode layer including a solid electrolyte layer on a surface of the dielectric layer; and a stress relaxation layer, wherein in a plan view of the first main surface, at least a portion of the stress relaxation layer overlaps with the anode plate, and the portion of the stress relaxation layer does not overlap with the cathode layer.

Capacitor array and composite electronic component

An electronic component that includes an electronic component body including a first internal electrode exposed at a first end surface and a second internal electrode exposed at a second end surface; a first external electrode on the first end surface and a bottom surface of the electronic component body; and a second external electrode on the second end surface and the bottom surface of the electronic component body, wherein the first external electrode comprises a first end surface electrode and a first bottom surface electrode that are integrated, and a thickness of the first end surface electrode is smaller than a thickness of the first bottom surface electrode, and the second external electrode comprises a second end surface electrode and a second bottom surface electrode that are integrated, and a thickness of the second end surface electrode is smaller than a thickness of the second bottom surface electrode.

Electronic component and method for manufacturing electronic component

A capacitor disposed inside a multilayer substrate that includes a conductive pattern on a surface thereof and an anode portion having a first conductive metal member and a porous portion disposed on a surface of the first conductive metal member, a cathode portion, and a dielectric layer disposed between the anode portion and the cathode portion. Moreover, the anode portion is led out to a surface side of the multilayer substrate by a connection electrode including an alloy layer containing a metal forming the first conductive metal member and a conductive layer disposed on the alloy layer, and in which the connection electrode is connected to the conductive pattern formed on the surface of the multilayer substrate.

Capacitor, connection structure, and method for manufacturing capacitor

An electrolytic capacitor that includes a resin molded body having opposed first and second end surfaces, the body including a stack that includes a capacitor element with an anode exposed at the first end surface, a dielectric layer on a surface of the anode, and a cathode opposite to the anode and exposed at the second end surface, and a sealing resin that encloses the stack; a first external electrode on the first end surface of the resin molded body and electrically connected to the anode; and a second external electrode on a second end surface of the resin molded body and electrically connected to the cathode, wherein the first external electrode and the second external electrode each include a resin electrode layer containing a conductive component and a resin component.

Electrolytic capacitor

A capacitor array that includes a solid electrolytic capacitor element including an anode plate made of a valve-action metal, a porous layer on at least one main surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer including a solid electrolyte layer on a surface of the dielectric layer; a first anodic through-electrode electrically connected to the anode plate; a second anodic through-electrode electrically connected to the anode plate; and a first cathodic through-electrode electrically connected to the cathode layer, wherein a distance between the first cathodic through-electrode and the first anodic through-electrode is the same or substantially the same as a distance between the first cathodic through-electrode and the second anodic through-electrode in a plane view from a thickness direction of the anode plate.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

Semiconductor composite device and package board used therein

A capacitor array that includes a plurality of solid electrolytic capacitor elements, a sheet-shaped first sealing layer, and a sheet-shaped second sealing layer. The plurality of solid electrolytic capacitor elements include an anode plate, a porous layer, a dielectric layer, and a cathode layer. Each of the solid electrolytic capacitor elements are partitioned from each other by a slit-shaped removal part and have a first main surface and a second main surface.

A capacitor array that includes a plurality of solid electrolytic capacitor elements each of which has a first main surface and a second main surface facing each other in a thickness direction and includes an anode plate made of a valve action metal, a porous layer on at least one surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer on a surface of the dielectric layer and including a solid electrolyte layer; a first sealing layer in a sheet-like shape and covering the first main surface of the plurality of solid electrolytic capacitor elements; and a second sealing layer in a sheet-like shape and covering the second main surface of the plurality of solid electrolytic capacitor elements.

Capacitor array, composite electronic component, method for manufacturing capacitor array, and method for manufacturing composite electronic component

A solid electrolytic capacitor that includes a multilayer body element having a number of first layers that are laminated together, the multilayer body element having first and second main surfaces that oppose each other in a lamination direction, first and second side surface that oppose each other in a width direction, and first and second end surfaces that oppose each other in a length direction; a sealing portion covering the first and the second main surfaces and the first and the second side surfaces, wherein in the first layers, a cutting region is formed at an end of the multilayer body element on a side of the second end surface and a sealing portion filled with a sealing material in the cutting region is exposed at the second end surface.

Method for producing solid electrolytic capacitor, and solid electrolytic capacitor

A solid electrolytic capacitor that includes: a capacitor element having a valve action metal base with a core portion, a first porous portion and a second porous portion, a first dielectric layer on the first porous portion, a first solid electrolyte layer on the first dielectric layer, a first conductor layer on the first solid electrolyte layer, a second dielectric layer on the second porous portion, and a second solid electrolyte layer on the second dielectric layer, the first dielectric layer and the first solid electrolyte layer constituting a first capacitance portion, and the second dielectric layer and the second solid electrolyte layer constituting a second capacitance portion; a cathode through electrode electrically connecting the first capacitance portion to a cathode external electrode; and a connection portion connecting the second capacitance portion to the first capacitance portion.

Solid electrolytic capacitor

Electrolytic capacitor having external electrodes with a resin electrode layer

A solid electrolytic capacitor is provided that includes a capacitor element having a valve action metal base with a porous portion on a first main surface of a core portion, a dielectric layer disposed on a surface of the porous portion, a solid electrolyte layer disposed on the dielectric layer, and a conductor layer disposed on the solid electrolyte layer. Moreover, the capacitor includes a sealing layer that seals a first main surface of the capacitor element, a cathode outer electrode electrically connected to the conductor layer, and an anode outer electrode electrically connected to the valve action metal base. The sealing layer and the cathode outer electrode are disposed on the conductor layer and a cathode through-electrode extends through the sealing layer on the conductor layer. The conductor layer and the cathode outer electrode are connected to each other with the cathode through-electrode interposed therebetween.

Solid electrolytic capacitor and method for manufacturing the same

A solid electrolytic capacitor that includes an element laminate having a first end face and a second end face, a first external electrode on the first end face, and a second external electrode on the second end face. In the element laminate, a first layer and a second layer are stacked. The first layer has a valve-action metal substrate, a dielectric layer on a surface thereof, and a solid electrolyte layer on the dielectric layer. The second layer contains a metal foil. The first layer and the second layer are bonded by an adhesive layer containing a conductive adhesive layer and an insulating adhesive layer that surrounds an outer perimeter of the conductive adhesive layer. The adhesive layer includes a notched part that extends from the first end face or the second end face to the conductive adhesive layer.

Growing community of inventors

Nagaokakyo, Japan

Takeshi Furukawa