Toyota Jidosha Kabushiki Kaisha

Nagoya University

The Doshisha

Okuno Chemical Industries Co., Ltd.

Toyota Infotechnology Center Co. Ltd.

Sulfur Chemical Laboratory Inc.

Takeshi Bessho

Makoto Honda

Motoki Hiraoka

Toshihisa Shimo

Kyoko Kumagai

Manabu Osamura

Hiroshi Yamaguchi

Hiroshi Yanagimoto

Masataka Deguchi

Takashi Yoshida

Kunio Mori

Nagahiro Saito

Fumitaka Yoshinaga

Masatsugu Nakanishi

Setsuto Daiza

Isami Kato

Kensuke Akamatsu

Takeaki Maeda

Hidemi Nawafune

Nobumasa Kimura

Sigeru Sibata

Haruhiko Yamasaki

Kazuo Hashimi

A measurement device for estimating thermal characteristics includes a heat generating source unit that has heat sensors for detecting heat radiating toward a measurement sample unit, and that heats the measurement sample unit, the measurement sample unit, and a heat cooling source unit that has heat sensors for detecting heat radiating from the measurement sample unit, and that cools the measurement sample unit, wherein those units are sequentially stacked, the measurement sample unit has a three-layer structure consisting of an object to be measured for estimating thermal characteristics, and heat conducting materials that sandwich the object, the heat conducting materials are adhered to the heat generating source unit and the heat cooling source unit one another through a heat-transfer promoting agent therebetween, the object to be measured for estimating thermal characteristics and the heat conducting materials are adhered to one another through physical contact, chemical contact, and/or chemical bond contact.

Measurement device for estimating thermal characteristics, and measurement method for estimating thermal characteristics by using same

The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.

Heat conduction structure or semiconductor apparatus

A magnetic fluid drive unithaving a double tubecomprising an inner tubeand an outer tubeformed on the outer side of the inner tube, and a magnetic field applicatorinstalled on the outer side of the double tube, the inner tubehaving, in the region where a magnetic field is applied by the magnetic field applicator, a high heat conducting regionand a low heat conducting regionaligned in the lengthwise direction of the inner tube, the inside of the inner tubebeing a heating medium flow path, and the area between the inner tubeand the outer tubebeing a magnetic fluid flow path.

Magnetic fluid drive unit and magnetic fluid driving method

The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

Method of plating stainless steel and plated material

A system and method for processing sensor signals is disclosed. The system comprises a sensor array, a multiplexer, a converter, a selection module and a combination module. The sensor array measures a physical parameter in a first dimension on a seat and generates a first set of sensor signals. The sensor array measures the physical parameter in a second dimension on the seat and generates a second set of sensor signals. The multiplexer multiplexes the first set of sensor signals into a first signal stream and the second set of sensor signals into a second signal stream. The converter converts the first signal stream to a first set of digital signals and the second signal stream to a second set of digital signals. The selection module determines a set of first-dimension data and a set of second-dimension data. The combination module forms a set of two-dimensional data.

Signal processing system

A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board

A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Method for production of electroless plating material

A system for measuring physical parameters of a tire, according to one embodiment of the present invention comprises a sensor layer and a circuit layer. The sensor layer is communicatively coupled to the circuit layer. The sensor layer is configured as a first thin film and embedded in the tire. The sensor layer provides a signal related to a physical parameter of the tire. The circuit layer is configured as a second thin film and embedded in the tire. The circuit layer processes the signal provided by the sensor layer.

Tire system

According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a moldwhich has protrusionsformed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste)to head portions of the protrusionsof the mold. The mold is heat- and pressure-welded to the surface of a substratethat is made of a resin film or the like. Accordingly, a pattern comprising the protrusionsand the conductive material layer (metal paste)are transferred to the substrateAfter transfer, the resin substrate (resin molding) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recesswhile the conductive material layeris used as a base material for the formation of a metal wiring A pattern of the recessestransferred to the substrate-side is determined depending on a pattern comprising the protrusionson the mold. Thus, a microfabricated high-density circuit pattern formed with metal wiringshaving arbitrary aspect ratios can be obtained.

Method for manufacturing a circuit board

A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Pretreatment method for electroless plating material and method for producing member having plated coating

A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.

Resin substrate having a resin-metal composite layer and method for manufacturing thereof

After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C&#x2014;OH bonds or C&#x2550;O bonds, thereby activating the surface of the plating material, and since a surface active agentis adsorbed thereon, a catalystis adsorbed on hydrophilic groups of the surface active agentwhich has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

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Toyota, Japan

Takeshi Bessho