Kabushiki Kaisha Toshiba

Ebara Corporation

Takeshi Ashihara

Isao Hayakawa

Yoshikuni Tateyama

Kunio Oishi

Hidetaka Nakao

Eisaku Hayashi

Yoshiaki Miyake

An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.

Polishing apparatus and polishing method

Growing community of inventors

Oita, Japan

Takeshi Ashihara