Sony Corporation

Sumitomo Heavy Industries, Ltd.

Nissan Motor Company Limited

Fuji Electric Co., Ltd.

Takeshi Aiba

Takashi Fukushima

Tomio Kusakabe

Fujio Yabuki

Masanori Nishimura

Tamiaki Matsuura

Hiroshi Ohtsuki

Takeshi Nomoto

Hiroshi Takishita

Masatoshi Tanaka

Takashi Yoshimura

Teppei Tanaka

Masahiro Takegawa

Fumiaki Nakao

Hiroshi Otsuki

Tamiaki Tatsuura

Satoshi Aizawa

A laser annealing method for a semiconductor device, includes: a first step of adding an impurity to a semiconductor substrate; and a second step of irradiating a region to which the impurity is added with a pulsed laser beam a plurality of times to anneal the semiconductor substrate. In the second step, a first region of a portion of the region to which the impurity is added is irradiated with the pulsed laser beam, and after a predetermined time interval, a second region adjacent to the first region is irradiated with the pulsed laser beam. The predetermined time interval is larger than a pulse interval of the pulsed laser beam.

Laser annealing method for semiconductor device, semiconductor device, laser annealing method, control device of laser annealing apparatus, and laser annealing apparatus

There is provided a laser machining device including a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam, and a determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit.

Laser machining device

A laser power control device includes a storage unit that stores relational data having a measurement value of a heat radiation sensor, which measures intensity of heat radiation of an irradiation object irradiated with a laser beam from a laser machining device in association with a power value of the laser beam on a machining surface of the laser machining device.

Laser power control device, laser machining device, and laser power control method

An object of the present invention is to provide an electrodeposition paint composition and a method of forming an electrodeposited coating, which exhibit quality of coating deposition even in the interior of narrow spaces of objects subjected to painting. A solution of the object is cationic electrodeposition paint composition in which in an aqueous medium contained are a cationic epoxy resin, a blocked isocyanate curing agent, a hydrophobic agent wherein an SP value of the hydrophobic agent (C) is 10.2 or more and less than 10.6 and is lower by 0.6 to 1.0 than an SP value of the cationic epoxy resin, a viscosity modifier, and a neutralizing acid, and in which coulombic efficiency of the cationic electrodeposition paint composition is 2.0 to 2.5 mg/(&#x3bc;m&#xb7;C). A voltage boost rate of the voltage in painting is 30 to 70V/10 seconds.

Cationic electrodeposition paint composition paintable even on narrow-clearance portion, and electrodeposition coating film using the same

A cationic electrodeposition coating is provided having excellent covering power (clearance application properties), edge anticorrosion properties, and finish properties. The cationic electrodeposition coating composition comprises a specific amino-group-containing epoxy resin; blocked polyisocyanate obtained by reacting an active hydrogen-containing component containing propylene glycol, and a polyisocyanate compound; and 0.1-20 mass parts of a cationic electrodepositing gelled microparticulate polymer obtained by crosslinking an acrylic copolymer containing hydrolyzable alkoxysilane groups and cationic groups, per a total of 100 mass parts of the solids fraction of the amino-group-containing epoxy resin and the blocked polyisocyanate compound.

Coating composition and method for forming coating film using same

An automatic assembling machine is disclosed for use with a carrier having parts arranged on it in predefined positional relationships which are defined by predetermined distances therebetween in two orthogonal directions. A movable table supports the carrier and moves in two orthogonal directions in a horizontal plan. A mounting surface extends above the plane of the movable table and has first and second portions which are parallel to the two orthogonal directions. At least one working unit is attached to at least one of the portions of the mounting surface to cooperate with movements of the table in assembling the parts on the carrier.

Automatic assembling machine

An automatic assembling apparatus includes a pair of parallel conveyers for transferring carriers, each carrier having four chassis and parts to be assembled on the chassis; a plurality of assembly stations, each having a movable table on which various assembling operations can be performed with respect to the carriers; a carrier loader associated with each assembly station and movable between a first position in opposing relation to the movable table thereof and a second position in opposing relation to the conveyers, and having a pair of chucking stations in opposing relation to the pair of parallel conveyors, respectively, when the carrier loader is at the second position for simultaneously feeding and discharging the carriers to and from the conveyers and in opposing relation to the respective assembly station when the carrier loader is at the first position for feeding and discharging the carriers to and from the respective assembly station; a plurality of stopping members associated with respective ones of the assembly stations for selectively stopping carriers adjacent respective ones of the assembly stations; and sensing elements for detecting the presence of the carriers on the pair of parallel conveyers for controlling the stopping members in response thereto so as to selectively stop carriers adjacent respective ones of the assembly stations.

Automatic assembling apparatus

A machine for automatically assembling equipment composed of parts at least some of which are arranged on a carrier includes a movable table which supports the carrier and which moves in two orthogonal directions in a horizontal plane. A tray is supported on the table and has additional parts or tools arranged thereon for use during assembly. A mounting surface extends above the plane of the movable table and has first and second portions parallel to the two orthogonal directions. At least one working unit is attached to at least one of the portions of the mounting surface for selective engagement with the parts and the tools on the tray upon movements of the movable table in assembling the equipment.

A carrier for supplying to an automatic assembling machine at least one chassis and several parts to be assembled on each chassis includes a first portion for receiving each chassis and a second portion associated with the first portion for storing the parts to be assembled on the chassis. According to the method, the chassis are loaded on the first portions of the carrier and sets of corresponding parts are loaded on the second portions in a predetermined relationship, whereupon, corresponding parts of the sets are simultaneously transferred to the respective chassis.

Growing community of inventors

Kanagawa, Japan

Takeshi Aiba