Tdk Corporation

Takeru Yoshida

Shogo Murosawa

Naoto Imaizumi

Keiichi Takizawa

Takuya Imaeda

Hideki Kamo

Masaaki Togashi

Nobuto Morigasaki

Takashi Aoki

Toshihiko Kaneko

Kazuhiro Komatsu

Chris T Burket

Tomohisa Fukuoka

Yuhta Matsunaga

Tatsuya Fujino

Haruki Ebina

An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.

Electronic component device

A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

Multilayer capacitor and electronic component device

A multilayer capacitor includes an element, a first external electrode, a second external electrode, and a plurality of internal electrodes. The plurality of internal electrodes include first internal electrodes, second internal electrodes, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected by a connection conductor. First capacity parts are constituted of the first internal electrodes and the third internal electrodes, and second capacity parts are constituted of the second internal electrodes and the third internal electrodes. The first capacity part and the second capacity part are electrically connected in series, and the connection conductor is disposed on at least one of the three lateral surfaces other than the lateral surface that is a mounting surface, among the four lateral surfaces.

Multilayer capacitor

A dielectric ceramic composition and a ceramic electric device having a dielectric layer composed of the dielectric ceramic composition including a main component having a perovskite crystal structure expressed by general formula ABO, an oxide of Eu, an oxide of Ra (Sc, Er, Tm, Yb and Lu), an oxide of Rb (Y, Dy, Ho, Tb and Gd) and an oxide of Si, in which 0.075&#x2266;&#x3b1;&#x2266;0.5, 0.5&#x2266;&#x3b2;&#x2266;3, 1.0&#x2266;&#x3b3;&#x2266;4, 1.5&#x2266;&#x3b4;&#x2266;5, and 0.030&#x2266;&#x3b1;/&#x3b4;&#x2266;0.250 where a content of an oxide of Eu is &#x3b1; mole, a content of the oxide of Ra is &#x3b2; mole, a content of the oxide of Rb is &#x3b3; mole, and a content of the second sub-component is &#x3b4; mole with respect to 100 moles of the main component.

Dielectric ceramic composition and ceramic electronic device

A dielectric ceramic composition includes at least dielectric particles having a core-shell structure and segregation particles, a concentration of a rare earth compound in the segregation particle is twice or more than an average concentration of the rare earth compound in a shell part of the dielectric particle having the core-shell structure, an area occupied by the segregation particles is 0.1 to 1.1%, when a maximum particle size of the segregation particle is defined as r, a minimum particle size of the segregation particle is defined as r, and an average particle size of the dielectric particle having the core-shell structure is defined as r, a relation of r/r&#x2266;2.00 and r/r&#x2267;0.25 is satisfied, and the segregation particles substantially do not include Mg.

Dielectric ceramic composition and electronic component

A multilayer capacitor comprises a capacitor element body constituted by a plurality of laminated dielectric layers; first and second signal terminal electrodes and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a ground electrode, first and second signal electrodes, and an intermediate internal electrode which are arranged within the capacitor element body. The first signal electrode is connected to the first signal terminal electrode, while the second signal electrode is connected to the second signal terminal electrode. The ground electrode is connected to the ground terminal electrode and has a first region overlapping the first signal electrode in a first direction in which the plurality of dielectric layers are laminated and a second region overlapping the second signal electrode in the first direction. The intermediate internal electrode is arranged such as to be separated from the first and second signal terminal electrodes and the ground terminal electrode and positioned between the first signal electrode and the ground electrode and between the second signal electrode and the ground electrode. The intermediate internal electrode has a region overlapping the first region in the first direction and a region overlapping the second region in the first direction.

A feedthrough multilayer capacitor mounting structure including a capacitor body, at least two each of first and second signal terminal electrodes, and at least one each of first and second grounding terminal electrodes. The capacitor body has a plurality of insulator layers laminated, a first signal inner electrode connected to two first signal terminal electrodes, a second signal inner electrode connected to two second signal terminal electrodes, a first grounding inner electrode connected to one first grounding terminal electrode, and a second grounding inner electrode connected to one second grounding terminal electrode. The first signal inner electrode and second grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The second signal inner electrode and first grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The first and second signal inner electrodes include respective portions opposing each other while holding therebetween at least one of the insulator layers.

Feedthrough multilayer capacitor mounting structure

A feedthrough multilayer capacitor array having a capacitor body which has a plurality of insulator layers laminated, a first signal inner electrode connected to two first signal terminal electrodes, a second signal inner electrode connected to two second signal terminal electrodes, a first grounding inner electrode connected to one first grounding terminal electrode, and a second grounding inner electrode connected to one second grounding terminal electrode. The first signal inner electrode and second grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The second signal inner electrode and first grounding inner electrode include respective portions opposing each other while holding therebetween at least one of the insulator layers. The first and second signal inner electrodes include respective portions opposing each other while holding therebetween at least one of the insulator layers.

Feedthrough multilayer capacitor array

A multilayer capacitor comprises a multilayer body in which dielectric layers and first and second inner electrodes are alternately laminated, and first and second terminal conductors and first and second outer connecting conductors. At least one each of first and second terminal conductors and the first outer connecting conductor are formed on a first side face of the multilayer body. At least one each of the first and second terminal conductors and the second outer connecting conductor are formed on a second side face of the multilayer body opposing the first side face. Each inner electrode is electrically connected to the corresponding outer connecting conductors. First and second inner connecting conductors electrically connected to the corresponding terminal and outer connecting conductors are laminated in the multilayer body. An equivalent series resistance is set to a desirable value by adjusting the number or positions of the inner connecting conductors.

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Tokyo, Japan

Takeru Yoshida