Nippon Steel Corporation

Nippon Steel Chemical Co., Ltd.

Other

Takero Teramoto

Kazuhiro Watanabe

Masao Sakashita

Shingo Kazama

Hironobu Kawasato

Yoshiyuki Harada

Hiroharu Inoue

Tetsuo Sakamoto

Tsutomu Kaneta

Bunji Shimomura

Kazuaki Harada

Masaya Furukawa

Takeshi Fujiyama

Kazuhiro Sugiyama

Koji Matsui

Tadanori Shimoto

Koichi Fujishiro

Nobuyuki Furukawa

Masayoshi Isozaki

Hideki Andoh

Masatoshi Yuasa

Kizo Hattori

Naoki Yokoyama

Masanori Kohno

Tutomu Kaneta

Shinsuke Iguchi

Kohki Inada

Masao Ohgawara

Takashi Usami

Silicone resin and photosensitive resin composition containing the same

This invention relates to a silicone resin composition comprising a silicone resin and an unsaturated compound. This resin composition is formulated from a silicone resin which has in its structural unit cage type polyorganosilsesquioxane whose siloxy groups are linked to a triorganosilyl group represented by &mdash;Si(CH ) &mdash;X (wherein X is &mdash;R &mdash;OCO&mdash;CR &boxH;CH , &mdash;R &mdash;CR &boxH;CH or &mdash;CH&boxH;CH , R is an alkyl group, an alkylidene group or phenylene group and R is a hydrogen atom or an alkyl group) and an unsaturated compound which contains an unsaturated group represented by &mdash;R &mdash;CR &boxH;CH or &mdash;CR &boxH;CH (wherein R is an alkylene group, an alkylidene group or &mdash;OCO&mdash; group and R is a hydrogen atom or an alkyl group) at the weight ratio of the silicone resin to the unsaturated compound in the range of 1:99 to 99:1. The copolymer to be obtained from this silicone resin composition shows such excellent heat resistance and light transmission as to be capable of substituting for glass, low water absorption, high dimensional stability and good moldability.

Silicone resin compositions and molded products of silicone resins

A method of making a multilayer buildup printed circuit board and mounting substrate wherein a resin laminated wiring sheet, which has a copper foil, an epoxy-acrylate photosensitive resin composition having a fluorene structure, and a conductive pattern, are overlaid on the conductive pattern side of a supporting substrate at 100&deg; C. and 3 kg/cm , and adhered thereto at 200 to 300&deg; C. and 10 kg/cm . The copper foil is entirely etched by wet-etching or is etched into a predetermined pattern so as to form a wiring structure. Since the epoxy-acrylate photosensitive resin composition is not treated at 100&deg; C. or more, and hence is in a semi-cured state, the epoxy-acrylate photosensitive resin composition can be heat-bonded onto the supporting substrate.

Resin laminated wiring sheet, wiring structure using the same, and production method thereof

A liquid crystal display device has a light shielding layer at a portion excluding a display pattern on a transparent substrate wherein material for the light shielding layer has an electrical insulation property of not less than 10 &OHgr;/&square; in terms of insulation resistance and an optical density (OD value) of not less than 2.0 per a film thickness of 1 &mgr;m.

Liquid crystal display device

This invention relates to silicone compounds in which terminal SiO of cage-type and/or ladder-type polyphenylsilsesquioxanes is wholly or partly linked to a triorganosilyl group containing reactive functional group X and also relates to a process for preparing said silicone compounds by subjecting cage-terminated and silanol-free cage-type and/or ladder-type polyphenylsilsesquioxanes to an equilibrium reaction under heat with disiloxanes containing reactive functional group X of the following structural formula

Silicone compounds and process for producing the same

This invention relates to an aromatic ester (meth)acrylate dendrimer composed of the core formed by an aromatic polycarboxylic acid and the branches formed by an aromatic compound containing one hydroxyl group and two carboxyl groups and represented by the following general formula (1)

Aromatic ester (meth)acrylate dendrimers and curable resin composition

Color filters and materials and resins therefor

Ortho spiroesters and curable and cured resin compositions of same

This invention relates to separation membranes composed of a mixture of two kinds or more of polymers containing at least one kind of polymer selected from polyesters, polyethers, polycarbonates, polyamides, and polyimides with a fluorene skeleton and possessing a spongy structure throughout and the membranes can be made by a known simple process, have not only excellent separatory ability but also good mechanical properties, and are particularly useful for ultrafiltration membranes and gas separation membranes.

Separation membranes

Epoxy acrylate resins of this invention having a structure of the general formula (I) ##STR1## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 are heat-resistant, solvent-soluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.

Epoxy acrylate resins and photosensitive resin compositions therefrom

A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) and (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having units (III) and (IV) and (IV'):

Organic polymer separation membrane having fluorene skeleton and oxygen

A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) an (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having units (III) and (IV) and (IV'):

A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) and (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having unit (III) and (IV) and (IV'):

A heat-resistant unsaturated polyester having a structure represented by the formula (I)

Heat-resistant unsaturated polyester

A soluble polyimide having a chain member substantially represented by the formula:

Growing community of inventors

Kawasaki, Japan

Takero Teramoto