Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Takeo Yasuho

Masaaki Hayama

Hiroshi Kushitani

Yasushi Nagata

Hiroshi Higashitani

Yuji Yagi

Masao Iwata

Koji Hashimoto

Akira Hashimoto

Kazuhiro Miura

Hayami Matsunaga

Michiaki Tsuneoka

Hitonobu Furukawa

Yoshikazu Suehiro

Norihisa Mino

Toshio Ishizaki

Hiroaki Ozeki

Yuki Satoh

Susumu Fukushima

Sadashi Kageyama

Masaaki Katsumata

Eiji Kawamoto

Kazuo Takeda

Hirofumi Tajika

Hiroki Yabe

Hisaya Kato

Ryoichi Kaiwa

Toshio Sugawa

Tomoyuki Iwasaki

Yuichiro Suganuma

Shinobu Nakaya

Izumi Okamoto

Satoshi Murakawa

Yasuhiko Yokota

Yuki Sato

Ryoichi Katsuragawa

Mitsuru Miyake

Katsumi Kohzu

Hayami Matunaga

Masaki Hayama

Shuji Ida

A micro lens includes a base material and a lens formed on the base material, wherein the lens is disposed at an opening on the base material, and the opening is formed by covering a surface of the base material with a first monolayer; and the first monolayer has critical surface energy of 22 mN/m or lower and shows non-affinity for a lens material in comparison with a region within the opening, and is fixed to the surface of the base material via a covalent bind.

Micro lens, micro lens array, and method of manufacturing the same

A digital broadcast receiving apparatus, which has a receiving circuit for receiving a transmitted high frequency signal of a plurality of time division multiplexed programs, includes a circuit for selecting a better receiving characteristic condition while a desired program is not received.

Digital broadcast receiving apparatus

A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Circuit board and method of manufacturing the same

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollow, or hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

Module part

A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove () is formed in a solder resist () located between two electrodes () to which a circuit component () is connected. A configuration is used in which the space between the first groove () and circuit component () is filled with a first insulating resin ().

Circuit-component-containing module

A surface acoustic wave filter having a plurality of the transmission lines, each with one end connected to the surface acoustic wave element and the other end thereof connected to a ground. The transmission lines are divided by an additional transmission line which has multiple connections to a ground electrode at an interval equal to or lower than a wavelength of a using frequency. This structure provides grounds among a plurality of transmission lines and thus isolation among terminals can be increased to improve the filter characteristic.

Surface acoustic wave filter

A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Module component

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollowor hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

DC/DC converter includes a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.

Voltage step-up and step-down DC/DC converter

A small antenna has two or more feeding ports. A radiator is made of a planar conductor having a substantially circular shape having the diameter of a substantially half wavelength or a substantially regularly polygonal shape where the length of a diagonal line passes through the center point is the substantially half wavelength. A ground plate is faced to the radiator. On the radiator, the feeding ports are connected to feeding points on two orthogonal line segments passing through the center of the radiator. This antenna is used as not only a single antenna but also two independent antennas having secured isolation between the feeding ports. A small antenna device used as two independent antennas is thus provided. The radiator is formed in a hat shape having an edge, has an Stepped Impedance Resonator (SIR) structure where the diameter of a crest part is a quarter wavelength, and is shortened.

Antenna device

A high-frequency compound switch module of this invention has a first communication system comprising a switch unit for switching connection of a signal from an antenna to one of a transmission circuit and a reception circuit of the first communication system based on a signal from a control terminal, a filter provided on a first reception circuit side, for filtering out a first reception signal, and a first phase shift line provided between the filter and the switch unit, and a second communication system comprising a second phase shift line provided between the switch unit and the first phase shift line, and a branching filter provided in series to the second phase shift line for branching a signal from the second phase shift line into a second transmission signal and a second reception signal. The switch module is capable of performing at least a receiving process of the first communication system while performing transmission/reception with the second communication system.

High-frequency compound switch module and communication terminal using it

A frequency switch is configured with two FET switches. One end of a second FET switch is connected between an I/O port and a reception port and the other end is ground. A strip line is connected between the second FET switch and the I/O port, and has an electrical length equivalent to &#xbc; wavelength of a high frequency signal input from transmission port.

High frequency switch

A high frequency switch configured particularly with FET switches. One end of second FET switch is connected between I/O port and reception port and the other end is ground. A parallel unit of strip line and capacitor is connected between second FET switch and I/O port. This parallel unit has the electrical length equivalent to &#xbc; wavelength of the high frequency signal input from transmission port.

Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.

Growing community of inventors

Neyagawa, Japan

Takeo Yasuho