The Furukawa Electric Co., Ltd.

Murata Manufacturing Co., Ltd.

Nippon Steel & Sumikin Chemical Co., Ltd.

Takeo Uno

Yuji Suzuki

Satoshi Fujisawa

Kazuo Yoshida

Kyota Susai

Shuichi Kitagawa

Sunao Fukutake

Yoshimasa Nishi

Yuko Okuno

Takahiro Tsuruta

Koichi Hattori

Kengo Mitose

Akira Kawakami

Kuniteru Mihara

Chikahito Sugahara

Naoya Kuwasaki

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from &#x2212;0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.

Surface-treated copper foil, and copper-clad laminate and circuit board using same

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 &#x3bc;m or more and 0.30 &#x3bc;m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Surface-treated copper foil, and copper-clad laminate and printed wiring board using same

A metallic material for an electrical electronic includes a CU&#x2014;Sun alloy layer () provided on a conductive base (). A Cu concentration of the Cu&#x2014;Sn alloy layer gradually decreases from the base side to the surface () side.

Metal material for electrical electronic component

Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 &#x3bc;m or below. On the roughened surface, an Ni&#x2014;Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 &#x3bc;m, a height of 0.6-1.8 &#x3bc;m and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 &#x3bc;m. The aforesaid Ni&#x2014;Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dmor more.

Surface-treated copper foil, method for producing same, and copper clad laminated board

The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface&#x3e;third interface, and second interface&#x3e;third interface.

Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrate

In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni&#x2014;Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni&#x2014;Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dmor more to provide a flexible copper clad laminate.

Flexible copper clad laminate

To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni&#x2014;Zn alloy is deposited, wherein Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)&#xd7;100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dmor more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni&#x2014;Zn alloy is deposited, Zn content (wt %)=Zn deposition amount/(Ni deposition amount+Zn deposition amount)&#xd7;100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dmor more.

Surface treated copper foil and copper clad laminate

A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Connector and metallic material for connector

A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 &#x3bc;m or below; and a method of producing the same.

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Tokyo, Japan

Takeo Uno