Renesas Electronics Corporation

Renesas Technology Corp.

Takeo Toba

Kazuo Tanaka

Shunsuke Toyoshima

Yusuke Kanno

Masashi Arakawa

Natsuki Ikehata

Hiroyasu Ishizuka

Yusuko Kanno

A semiconductor integrated circuit device with a 'PAD on I/O cell' structure in which a pad lead part is disposed almost in the center of an I/O part so as to reduce the chip layout area. In the I/O part, a transistor lies nearest to the periphery of the semiconductor chip. When seen in a plan view of the I/O part, a resistance lies above the transistor and a first and a second diode lie above the resistance; a second transistor lies above the diodes; and a logic block lies above the second transistor with a pad lead part, for example, formed in a metal wiring layer, therebetween. This permits the pad through the second transistor to be on the same node and therefore the pad lead part can be disposed almost in the center of the I/O part.

Semiconductor integrated circuit device having an NMOS with a high resistance drain terminal

An output signal characteristic of a differential amplifier circuit is improved. When an input data signal becomes 'Low', current flowing through a first transistor will decrease and potential at a connection (a node) between a first resistor and a second resistor will increase. This potential is input (negatively fed back) to the gate of a second transistor, and because this gate potential increases, a tail current amount is adjusted in an increasing direction. When the input data signal becomes 'High', the current of the first transistor increases and thus the potential at the node decreases. Thus, the gate potential (negative feedback) of the second transistor decreases, and the tail current amount is adjusted in a decreasing direction. Thus, in the rising and falling of an input waveform, the difference in a delay time with respect to the output waveform decreases, respectively.

Semiconductor integrated circuit device

A semiconductor integrated circuit device including an I/O circuitry capable of low-voltage high-speed operation at low cost is provided. In the I/O circuitry, when an I/O voltage (for example, 3.3 V) is lowered to a predetermined voltage (for example, 1.8 V), portions causing a speed deterioration are a level conversion unit and a pre-buffer unit for driving a main large-sized buffer. In view of this, a high voltage is applied to a level up converter and a pre-buffer circuit. By doing so, it is possible to achieve an I/O circuitry capable of low-voltage high-speed operation at low cost.

Semicondutor integrated circuit device

Semiconductor integrated circuit device having I/O circuitry for low voltage operation

The present invention provides a semiconductor integrated circuit having two kinds of input/output circuits realizing higher speed and higher packing density with rational configuration. The semiconductor integrated circuit has a first input/output circuit operating on a first power source voltage, an internal circuit operating on a second power source voltage lower than the first power source voltage, and a second input/output circuit operating on a third power source voltage lower than the first power source voltage. In an output circuit of the first input/output circuit, signal amplitude corresponding to the second power source voltage is converted to signal amplitude corresponding to the first power source voltage by a level shifter, and a P-channel MOSFET and an N-channel MOSFET constructing the output circuit are driven. In an output circuit of the second input/output circuit, a drive signal is generated by a level shifter in a manner similar to the above to drive second and third N-channel MOSFETs for generating an output signal having signal amplitude corresponding to the third power source voltage.

Growing community of inventors

Higashimurayama, Japan

Takeo Toba