Hitachi, Ltd.

Nissan Motor Company Limited

Showa Denko K.k.

Takeo Tamamura

Naotatsu Asahi

Tomio Iizuka

Makoto Nakayama

Hisanobu Kanamaru

Yasuhiro Takahashi

Masazumi Sone

Hitoshi Suzuki

Masahiro Koizumi

Kunio Miyazaki

Masateru Suwa

Jin Onuki

Izumi Ochiai

Yukitsugu Hirota

Akira Saito

Hiromitsu Nagae

Masaichi Nagai

Toshimichi Terada

Takao Miyashita

Joo Ishihara

Yasushi Ohuchi

Ryota Mitamura

Tetsuroh Minemura

Arinobu Hamada

Kozo Tabata

Masataka Kasai

A resin encapsulated semiconductor device comprises a semiconductor element, a conductive base, a wire of aluminum connecting the element and the base, and a thermosetting resin encapsulating hermetically the component to protect the device from a mechanical stress and ambient atmosphere.

Semiconductor device using annealed bonding wire

A matrix for magnetic separators which comprises wire or ribbon of a crystalline magnetic alloy having a fine-grained structure and a supersaturated solid solution structure.

Magnetic separator matrix of cut pieces of an elongated crystalline

A method for pressure bonding metal members by utilizing eutectic reaction comprising the steps of bringing two metal members of dissimilar metals to be bonded into contact with each other under a predetermined contacting pressure P.sub.1 lower than the plastic deformation pressures of the metals of the two members and heating the contacting surfaces of the two members to a temperature lower than melting point temperatures of the metals and not lower than the eutectic temperature thereof to produce a liquid of eutectic composition by eutectic reaction between the surfaces of the two members to be bonded, applying an upset pressure P.sub.2 higher than the contacting pressure P.sub.1 to the surfaces to be bonded to squeeze out the liquid from the contacting surfaces of the two members to outside, and cooling the bonded surfaces of the two members. When the members to be joined by pressure bonding are of the same metal, an insert comprising an element undergoing eutectic reaction with the metal of the two members is interposed between the surfaces of the two members to be bonded.

Method for pressure bonding metal members by utilizing eutectic reaction

A distributor for internal combustion engines is disclosed, in which at least the spark discharge portion of the rotor electrode and/or each of the fixed electrodes is made of an alloy containing silicon, thus suppressing the generation of radio noise.

Distributor for internal combustion engine

Guiding drums for a magnetic tape scanning assembly for use in a video tape recorder and playback apparatus are made of a specific aluminum-silicon alloy consisting essentially of 8 to 15% by weight of silicon, 1 to 4% by weight of copper, 0.05 to 0.6% by weight of magnesium, and the balance being aluminum. A mean grain size of silicon crystal in eutectic structure is controlled to be 5 .mu.m or less. The drums are provided with a diagonal or helical guiding path on the peripheries thereof in which there are formed on the guiding path generally continuous, fine machining lines having a roughness (H max) of 1 to 6 .mu.m, preferably 2 to 5 .mu.m, in a direction parallel with sliding travel of a magnetic tape.

Magnetic tape scanning assembly for use in video tape recorder and

An aluminum alloy consisting essentially of 8 to 15% by weight of silicon, 0.05 to 0.7% by weight of magnesium, 1 to 4.5% by weight of copper, the balance being aluminum, wherein a silicon crystal in eutectic structure crystallized out in an aluminum matrix has a mean grain size not larger than 5 microns and intermetallic compounds of magnesium and copper are finely precipitated in the matrix as age-hardening elements for the matrix, and the alloy has at least 40 kg/mm.sup.2 tensile strength and at least 10% elongation, good antiwearing and excellent workability. The disclosure is also concerned with a method of making the above-mentioned aluminum alloy.

Aluminum alloys having improved mechanical properties and workability

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Hitachi, Japan

Takeo Tamamura