Fujitsu Corporation

Fujitsu Microelectronics Limited

Takeo Shigihara

Shinya Udo

Masatoshi Kokubun

Masao Kumagai

Hidekazu Nishizawa

A semiconductor device carries out a test utilizing contact with a probe needle without being affected by narrowing of the pitch at which output pads are arranged. The device is equipped with test circuits provided between a plurality of output buffers via which signals are output and output pads corresponding thereto. The test circuit includes output switches caused to sequentially make connections by a controller in test and interpad switches involved in making connections of the output pads with a test pad by the controller in test. In test, probe needles are brought into contact with the test pad. The output pads are not used in test, and can be arranged at a narrowed pitch. Thus, the chip area can be reduced and are therefore so that the pitch for the output pads can be narrowed and the chip area can be decreased.

Semiconductor device and liquid crystal panel driver device

An semiconductor integrated circuit includes a plurality of first pads having first size, a plurality of second pads having second size smaller than the first size, a switch circuit which couples the first pads to respective first core circuits in a first switching state, and couples the first pads to respective second core circuits in a second switching state, the second core circuits being connected to the second pads, wherein the first pads and the second pads are mixed and arranged in line.

Growing community of inventors

Kawasaki, Japan

Takeo Shigihara