Kyocera Corporation

Takeo Satake

Nobuyuki Tanaka

Daisuke Sakumoto

Toshihiko Kitamura

Atsushi Ogasawara

Akiko Matsuzaki

Taizou Suemitsu

Daisuke Tanaka

Kouji Kubota

In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.

Wiring base and electronic device

A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Package for housing optical semiconductor element and optical semiconductor device

A device housing package includes a base body () including, at its upper surface, a placement portion () of a semiconductor device (); a frame body () disposed on the base body () surrounding the placement portion (), including a notch () formed by cutting a side wall thereof; an input-output terminal () attached to the notch (), including a wiring conductor layer () electrically connected to the semiconductor device (); and a sealing ring () disposed on an upper portion of the frame body (). Moreover, side walls of the frame body () have, when seen in a plan view, an outer corner () of adjacent side walls having a curved surface, the outer corner () lying within a region overlapping the sealing ring () as seen in a plan view.

Device housing package and electronic apparatus employing the same

An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.

Growing community of inventors

Kyoto, Japan

Takeo Satake