Tokyo Electron Limited

Takeo Saito

Shuji Akiyama

Yutaka Akaike

Eiichi Matsuzawa

There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness tof a polishing plate, a thickness tof a polishing wafer and a magnitude textending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude tof a lip seal protruding from an upper surface of a chuck top.

Wafer inspection device and maintenance method for same

An inspection system, for inspecting an inspection target on a stage in a low temperature environment, includes a system main body including an inspection apparatus having inspection chambers each accommodating an inspection unit for performing electrical inspection of an inspection target on a stage and having inspection spaces arranged in multiple stages vertically, the plurality of inspection chambers being arranged horizontally, and a loader unit for transferring the inspection target with respect to the stage of the inspection unit; and a coolant supply unit configured to supply a coolant to the stage. The system main body further includes coolant line arrangement spaces, in which coolant lines extending from the coolant supply unit are arranged, provided above or below the respective inspection spaces to correspond to the respective inspection spaces, and the coolant lines are directed toward the corresponding inspection spaces in each of the coolant line arrangement spaces.

Growing community of inventors

Nirasaki, Japan

Takeo Saito