Oki Electric Industry Co., Ltd.

Valeo Thermal Systems Japan Corporation

Takeo Mizushima

Hirohisa Masuda

Hiroyuki Ishida

Christian Marsais

In order to solve the above-described problem, a semiconductor integrated circuit according to the present invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed along peripheral edge portions of the semiconductor chip so as to surround the core area and shaped in the form of bent patterns. Further, a semiconductor integrated circuit according to another invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed aslant toward peripheral portions of the semiconductor chip so as to surround the core area.

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Tokyo, Japan

Takeo Mizushima