Seiko Epson Corporation

Cambridge Display Technology Limited

Other

Takeo Kaneko

Tomoko Koyama

Tatsuya Shimoda

Takayuki Kondo

Jeremy H Burroughes

Akira Miyamae

Kimio Nagasaka

Katsumi Mori

Shojiro Kitamura

Atsushi Harada

Osamu Yokoyama

Takeo Kawase

Taketomi Kamikawa

Norio Oguchi

Satoshi Nebashi

Tsugio Ide

Satoru Miyashita

Jun Amako

Toshio Arimura

Eiichi Fujii

Kazuhiko Suzuki

Jeremy H Cambridge Dis Tech Ltd Burroughes

A multiple wavelength light emitting device is provided wherewith the resonance strength and directivity between colors can be easily adjusted for balance. This light emitting device comprises a light emission meansfor emitting light containing wavelength components to be output, and a semi-reflecting layer groupwherein semi-reflecting layersR,G, andB that transmit some light having specific wavelengths emitted from the light emission means and reflect the remainder are stacked up in order in the direction of light advance in association with wavelengths of light to be output. Light emission regions A, A, and Aare determined in association with the wavelengths of light to be output. The configuration is such that, in the light emission regions, the distances L, Land Lbetween a reflecting surface for fight from the light emission means side of the semi-reflecting layersR,G, andB that reflect light output from those light emission regions and a point existing in an interval from the end of the light emitting layer on the semi-reflecting layer group side to the reflecting layer are adjusted so as to have an optical path length at which that light resonates.

Multiple wavelength light emitting device, electronic apparatus, and interference mirror

A method of manufacturing directional coupler includes forming a first waveguide over a substrate, forming a separate section on respective ends of the first waveguide, and forming a second waveguide stacked over the first waveguide, wherein the first waveguide and the second waveguide are patterned by ink-jet process. The first waveguide and the second waveguide may be formed so as to overlap each other. The method may further include forming a projecting portion on the substrate, wherein the first waveguide being formed on the projection portion.

Method of manufacturing directional coupler

A light-emitting device includes a light-emitting layer capable of generating light by electroluminescence, a pair of electrodes applies an electric field to the light-emitting layer, and a substrate having a depression in a surface, and the light-emitting layer is disposed within the depression of the substrate.

Light-emitting device and electronic instrument

To provide an optical communication device suitable for the transmission of a high-frequency signal. An optical communication device includes a first substrate having a light-emitting element or a light-receiving element on one side of the first substrate; a second substrate having an electronic circuit to perform operation control of the light-emitting element or the light-receiving element; and a flexible substrate which connects the section between the light-emitting element or the light-receiving element and the electronic circuit while achieving impedance matching.

Optical communication device

To provide an optical module capable of miniaturization, the optical module, to which an optical plug provided at one end of an optical transmission path is attached, so as to transmit and receive signal light via the optical transmission path for information communication, includes: a transparent substrate having light transmittance property with respect to a wavelength of used signal light; an optical socket, which is arranged on one surface side of the transparent substrate and to which the optical plug is attached; an optical element, which is arranged on the other surface side of the transparent substrate and emits the signal light to the one surface side of the transparent substrate according to a supplied electrical signal, or generates an electrical signal according to the intensity of the signal light supplied from the other surface of the transparent substrate; and a reflective portion, which is arranged on the other surface of the transparent substrate and changes a path of the signal light emitted from the optical element at substantially 90 degrees to guide it to the optical transmission path, or changes a path of the signal light emitted from the optical transmission path at substantially 90 degrees to guide it to the optical element.

Optical module and manufacturing method of the same, optical communication device, opto-electrical hybrid integrated circuit, circuit board, and electronic apparatus

The invention provides an optical transceiver which makes it possible to simplify a production process. An optical transceiver of the present invention includes an optical socket to mount an optical plug disposed at one end portion of an optical fiber); a light-condensing device; and an optical element to emit light in accordance with a supplied electrical signal and an optical element to generate an electrical signal in accordance with a received light signal; and a light-transmissive substrate to support the optical socket, the light-condensing device, and the optical elements so that the optical fiber, the light-condensing device, and the optical elements are aligned on an optical axis of the optical transceiver.

Optical transceiver and method for producing the same

The invention provides a manufacturing method of an optical transceiver whereby the manufacturing process can be further simplified. A method to manufacture an optical transceiver includes: combining an optical socket and an assembling object to be assembled with the optical socket, where the optical socket includes a fitting hole to mount an optical plug holding an end portion of an optical fiber; mounting an optical head to photograph the assembling object in the fitting hole of the optical socket, and obtaining an image of the assembling object exposed to the fitting hole and reference position information in the photographed image display screen; a detecting a difference between the image of the assembling object and the reference position information; reducing the difference by moving the optical socket and the assembling object relative to each other based on the difference; and fixing the assembling object and the optical socket.

Method of manufacturing optical transceiver and adjustment device thereof

An optical module may include precise guide pins formed in a transparent substrate or an optical transmission line support member. The precise guide pins may be inserted into corresponding precise guide holes within the transparent substrate or the optical transmission line support member to precisely align optical elements. The precise guide holes may be formed within one of the transparent substrate and the optical transmission line support member by positioning protruding portions of a jig within over-sized guide holes and filling a gap between the protruding portions of the jig and the respective over-sized guide holes with a filler material. Once the filler material is cured, the jig may be withdrawn leaving precisely positioned guide holes.

Optical module and method of manufacturing the same, and hybrid integrated circuit, hybrid circuit board, electronic apparatus, opto-electricity mixed device, and method of manufacturing the same

The invention provides a surface emission laser which can be operated with low-current drive, and a manufacturing method therefor. The invention also provides a light reception element which provides high-speed modulation, and a manufacturing method therefor. The invention also provides an optical transceiver module which provides enhanced optical connection efficiency. An opening portion from the other surface side of the semiconductor substrate to the end portion on the semiconductor substrate side of the light emission portion is formed on the semiconductor substrate of the surface emission laser, and a lens made of a transparent resin is formed through the use of the side surface of the opening portion. An opening portion from the other surface side of the semiconductor substrate to the end portion on the semiconductor substrate side of the light reception portion is formed on the semiconductor substrate of the photodiode, and a lensmade of a transparent resin is formed through the use of the side surface of the opening portion. The lens formed on the light emission portion of the aforementioned surface emission laser and the lens formed on the light reception portion of the photodiode are placed facing each other without an optical waveguide therebetween.

Surface emission laser and manufacturing method for surface emission laser, light reception element and manufacturing method for light reception element, and optical transceiver module

An organic semiconductor device of the present invention has an organic semiconductor layer disposed within a depression formed in a substrate; a drain electrode and a source electrode; and a gate electrode to face the organic semiconductor layer with a gate insulating layer interposed. Alternatively, an organic semiconductor device of the present invention has an insulating layer disposed on a substrate; an organic semiconductor layer disposed within a depression formed in the insulating layer; a drain electrode and a source electrode; and a gate electrode disposed to face the organic semiconductor layer with a gate insulating layer interposed.

Organic semiconductor device

A light-emitting device includes a substrate and a light-emitting device section. The light-emitting device section includes a light-emitting layer capable of emitting light by electroluminescence, a pair of electrode layers for applying an electric field to the light-emitting layer, an optical section for propagating light generated in the light-emitting layer in a specific direction, and an insulation layer disposed between the pair of electrode layers, having an opening formed in part thereof and can function as a current concentrating layer for specifying a region through which current to be supplied to the light-emitting layer flows via a layer in the opening. The optical section has a defect section which forms photonic bandgaps capable of inhibiting a three-dimensional spontaneous emission, and the energy level of the defect section, caused by the defect, is set to be within a specific emission spectrum. Light generated in the light-emitting layer is emitted with a three-dimensional spontaneous emission being inhibited by the photonic bandgaps.

Light -emitting device

A light emitting device has a substrate and a light-emitting section formed on the substrate. The light-emitting section includes a light-emitting layer in which light is generated by electro-luminescence, first and second electrodes used to apply electric charges to the light-emitting layer, and first and second dielectric multi-layered films between which the light-emitting layer is interposed. The first and second electrodes are disposed to avoid overlap with a light-emitting region in the light-emitting layer as viewed from a light emitting direction.

Light emitting device, display device and electronic instrument

A multiple wavelength light emitting device is provided wherewith the resonance strength and directivity between colors can be easily adjusted for balance. This light emitting device comprises a light emission means for emitting light containing wavelength components to be output, and a semi-reflecting layer group wherein semi-reflecting layers R, G, and B that transmit some light having specific wavelengths emitted from the light emission means and reflect the remainder are stacked up in order in the direction of light advance in association with wavelengths of light to be output. Light emission regions A , A , and A are determined in association with the wavelengths of light to be output. The configuration is such that, in the light emission regions, the distances L , L and L between a reflecting surface for fight from the light emission means side of the semi-reflecting layers R, G, and B that reflect light output from those light emission regions and a point existing in an interval from the end of the light emitting layer on the semi-reflecting layer group side to the reflecting layer are adjusted so as to have an optical path length at which that light resonates.

Growing community of inventors

Misato-mura, Japan

Takeo Kaneko