Takeda Chemical Industries, Inc.

Takenori Momiyama

Masakazu Oi

Keiiti Mizutani

Shinji Hanatani

A mold assembly for use in a packaging machine for making a blistered package, which forms a plurality of blisters in a web of thermoplastic resin film forming a part of the blistered package. The mold assembly comprises a preforming structural body formed with a plurality of preforming molds and a finishing structural body formed with the corresponding number of finishing molds arranged in the same pattern as the preforming molds. The thermoplastic resin web is first subjected to a preforming process with the preforming structural body and then to a final forming process with the finishing structural body thereby to avoid excessive and quick reduction of the wall thickness which may otherwise be observable in any of the finally formed blisters. A method for this purpose is also disclosed.

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Osaka, Japan

Takenori Momiyama