Kabushiki Kaisha Toshiba

Takema Ito

Hiroyuki Morinaga

Arata Inoue

Takashi Sakamoto

Takuya Kono

Atsushi Onishi

Yasuhiro Kaga

Masayoshi Yamasaki

According to the present invention, there is provided a semiconductor manufacturing apparatus having:

Semiconductor manufacturing apparatus and method thereof

A defect inspecting apparatus comprising:

Defect inspecting apparatus for semiconductor wafer

A system for making a recipe for each of manufacturing tools used to manufacture products includes a merging unit merging product information for the products and process information for each of manufacturing processes used for the products to make intermediate recipe data, and a making unit making the recipe for each of the manufacturing tools by merging information of the intermediate recipe data and information of a basic recipe including information of parameters, which specify operations of the manufacturing tools and are commonly set in the manufacturing processes.

System and program for making recipe and method for manufacturing products by using recipe

A design system for delivering data via a network to a plant, which fabricates a semiconductor device by direct writing, includes: a data conversion unit generating the data specified by a product name of the semiconductor device, a layer name, and a machine type of an electron beam lithography system for the direct writing; a central memory unit recording the data; and a plant mediator distributing the data to the plant via the network, and re-distributing the data to the plant in response to a download request associated with the product name, the layer name, and the machine type.

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Yokohama, Japan

Takema Ito